Novel electronic tag production process

Abstract

The invention discloses a novel electronic tag production process, which comprises the following steps of step 1.sintering and curing a printed antenna and a substrate to form an antenna substrate through the existing conventional process; step 2.placing an IC chip into a groove structure of the antenna substrate and adopting the existing conventional technical method to bind the IC chip on a feeding point of the antenna in the groove without epoxy resin dripping protection; step 3.providing a ceramic cover; step 4.bucklling the cover in the step 3 on the groove structure of the substrate and pre-coating oxidizing reaction glue on a contact place, wherein the IC chip is arranged in the cover, and two sides of the cover are ends of the antenna, which are used for adjusting a tag frequency band; and step 5.sintering at high temperature (the field is usually within the range of 600-700 DEG C), and reacting and sintering the oxidizing reaction to make the ceramic cover and the ceramic substrate form a whole body on the groove structure and form a closed space. A product obtained by the process of the invention is suitable for various high and low temperature application environments.

Description

technical field [0001] The invention relates to a preparation process of an electronic label of radio frequency identification technology. Background technique [0002] Traditional chip and RFID antenna binding methods include: FLIP CHIP (inverted packaging), wire bonding (WIRE Bonding), SMT reflow wave soldering. [0003] FLIP CHIP (upside-down packaging) uses asynchronous conductive adhesive in all directions, and realizes the connection between the chip pin and the antenna through extruded metal balls, and the cured conductive adhesive in other places provides overall support. However, the conductive adhesive will also be denatured and damaged at high temperatures exceeding 250°C, resulting in connection failure. [0004] Wire bonding (WIRE Bonding): Use gold wire or aluminum wire to connect the chip pin and the bonding point of the antenna. The epoxy resin dripped onto the chip wraps the chip and wires like amber, and after drying at 180°C, the cured epoxy resin glue p...

AI Technical Summary

Problems solved by technology

Some high-temperature-resistant materials such as PPA can not deform at 300°C, and can indeed protect the connection between the chip and the antenna from damage in a short period of time. However, if the tag is kept at 300°C for too long, the surface temperature of the electronic tag will still reach the same temperature. The epoxy or conductive glue protecting the bonding point will be damaged and cause the tag chip to disconnect from the antenna and fail

[0007] In addition, adding plastic shell materials to the high-temperature-resistant ceramic materials, silicon chips, and metal wires will greatly increase the overall cost, which will greatly limit the application range of RFID technology.

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