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Curable thermosetting resin composition

A solid resin and composition technology, applied in the field of polymer compounds and their preparation, can solve the problems of reducing other properties of the composition, low dielectric constant and dielectric loss factor, etc., and achieve high glass transition temperature, low dielectric constant effect

Active Publication Date: 2017-03-15
BAMSTONE NEW MATERIAL TECH (WUHAN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Existing methods still cannot meet the requirements of high glass transition temperature, low dielectric constant and dielectric loss factor, and flame retardancy by adding a substance
In addition, the addition of non-reactive additives that do not contain reactive functional groups capable of reacting with epoxy resins generally degrades other properties of the composition

Method used

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  • Curable thermosetting resin composition
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0021] For various embodiments, the polypolymer has the following three or four structural units:

[0022] The structural unit (I) is:

[0023] The structural unit (II) is:

[0024] The structural unit (III) is:

[0025] The structural unit (IV) is:

[0026] Wherein each m, n, r and s are independently a natural number representing the mole fraction of the corresponding constituent unit in the copolymer, each R is independently hydrogen, an aromatic group or an aliphatic group, and each AR is independently Aromatic group. Structural unit (I), structural unit (II), and structural unit (III) are essential units.

[0027] For various embodiments, the structural unit (I) accounts for 0.1-60wt% of the copolymer, preferably 0.5wt%, 1wt%, 3wt%, 5.5wt%, 10wt%, 11wt%, 15wt%, 20wt%, 40wt% , 50wt%, 60wt% The molar ratio of structural unit (II) to structural unit (III) is 1:1-20:1, preferably 1:1, 2:1, 3:1, 4:1, 5:1, 6:1, 7:1, 8:1, 9:1, 10:1, 11:1, 12:1, 15:1, 16:1, 17:1, 18...

Embodiment

[0040] Below, the present invention is further described in detail through examples. "Parts" mentioned in the Examples of the present invention, unless otherwise specified, means parts by mass.

Synthetic example 1

[0041] Synthesis example 1: Synthesis of multi-component copolymer (P1-1)

[0042] Add 83.3g styrene, 34.6g N-phenylmaleimide, 19.6g maleic anhydride in a 500ml four-necked flask, then add 1.375g initiator BPO and an appropriate amount of chain transfer agent, 200g solvent butanone, 13.75 g PAM-100, heat, stir evenly, control the reaction temperature at 80°C, and react for 6-8 hours. The reactant was distilled under reduced pressure to remove the solvent to obtain a tetrapolymer (P1-1).

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Abstract

The invention relates to a curable thermosetting resin composition, which includes a multi-copolymer comprising monomers represented as the general formulas (I), (II), (III) and (IV), epoxy resin, a curing agent and the like components. Creatively, phosphorus element is introduced into the ternary or quadri-copolymer, which can be subjected to crosslinking reaction with the epoxy resin. The copolymer is mixed with the epoxy resin and the like components to form the composition, so that demands of high glass-transition temperature, low dielectric constant and dielectric loss factor and certain flame retarding property of a cured product of the composition are satisfied at the same time. The composition can be widely applied in composite materials, such as printing circuit boards, high-voltage insulator, mobile communication base station antenna shield, etc, which require low dielectric performance. The multi-copolymer can be prepared through two methods, one is corresponding monomer direct copolymerization and the other one includes firstly hydroxyl group-containing monomer copolymerization and then phosphate esterification.

Description

technical field [0001] The invention relates to high molecular compound and its preparation, in particular to curable thermosetting resin composition containing a multi-component copolymer and epoxy resin. Background technique [0002] A curable thermosetting resin composition comprising an epoxy resin and a curing agent thereof is widely used in the fields of composite materials, coatings and the like. In the application fields of electrical insulation composite materials and wave-transparent composite materials, the glass transition temperature, dielectric constant, dielectric loss factor, and flame retardancy are very key technical indicators. For example, for electrical insulation products such as laminated composite boards and PCB boards, a sufficiently high glass transition temperature can make the material effectively used in high-temperature environments, and low dielectric constant and dielectric loss factor can help carry current The area is separated from other a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F212/08C08F230/02C08F222/08C08F222/40C08F220/28C08F2/38C08F8/40C08L63/00C08L35/06
CPCC08L63/00C08F212/08C08J2363/00C08J2425/08C08J5/244C08F222/40C08F222/08C08F230/02C08K7/14C08L35/06C08F30/02C08L2203/20C08L25/14
Inventor 刘伟肖瑞敏王璐
Owner BAMSTONE NEW MATERIAL TECH (WUHAN) CO LTD
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