LED deep ultraviolet flip chip with quartz glass substrate

Abstract

The invention discloses an LED deep ultraviolet flip chip with a quartz glass substrate. By means of the characteristic of deep ultraviolet light capable of transmitting quartz glass, a single surface of the quartz glass emits light, a deep ultraviolet GaN LED structural layer is grown on the other plane of the quartz glass, a positive electrode P and a negative electrode N on the chip are used for heat conduction and dissipation, current inlet and outlet and heat sink welding, because of the LED deep ultraviolet flip chip with the quartz glass substrate, subsequent product packaging processes such as lead frame, routing and adhesive sealing can be omitted, an epitaxial layer is protected by using the quartz glass as a chip lens, the anti-static capability is also improved, and important effects of reducing oxidization and prolonging the service lifetime of a device are achieved. After the adoption of the flip-chip technical scheme, thermal management of the LED chip can be effectively improved, a large current can pass through the chip, a flicker caused by gold wire pseudo soldering or unfavorable contact can be prevented, and the problems of difficulty in heat dissipation, small power, short service lifetime and large light attenuation of the deep ultraviolet LED chip are solved.

Description

technical field [0001] The invention relates to the field of LED deep ultraviolet chips, in particular to a quartz glass substrate LED deep ultraviolet flip chip. Background technique [0002] With the advancement of science and technology, the development of the economy, and the improvement of living standards, people will pursue a high-quality life and pay more attention to health. These demands will inevitably stimulate the development of the deep ultraviolet LED application market. The deep ultraviolet LED replaces the original application technology and products and has a broad market. At present, the main problem facing the development and application of many deep ultraviolet LED products is the LED deep ultraviolet chip. The output power of the LED is not high, which directly affects the development and application of the product; the design of the LED deep ultraviolet chip and the thermal management system is a very important link. When the temperature of the LED ris...

AI Technical Summary

Problems solved by technology

These demands will inevitably stimulate the development of the deep ultraviolet LED application market. The deep ultraviolet LED replaces the original application technology and products and has a broad market. At present, the main problem facing the development and application of many deep ultraviolet LED products is the LED deep ultraviolet chip. The output power of the LED is not high, which directly affects the development and application of the product; the design of the LED deep ultraviolet chip and the thermal management system is a very important link. When the temperature of the LED rises, the efficiency and service life of the LED will decrease rapidly. , which shows that thermal management is not only important for deep ultraviolet LED chips, but also plays a decisive role in the entire deep ultraviolet disinfection system. However, the current deep ultraviolet LED chip substrate generally uses sapphire, but the thermal conductivity of sapphire substrate Poor, it is almost unrealistic to produce high-quality, high-current and high-power deep-ultraviolet LED chips on a sapphire substrate. In addition, to manufacture LED chips on a sapphire substrate, the P electrode and N electrode for ohmic contact can only be prepared on the epitaxial layer. On the same side, a considerable part of the light emitted from the front is blocked by the electrodes and bonding leads, which affects the working efficiency of the deep ultraviolet LED chip

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