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Process for preparing low water absorption epoxy resin type packaging material

A technology of epoxy resin and packaging materials, applied in the direction of epoxy resin glue, adhesive type, fibrous filler, etc., can solve the problems of loose wiring structure, poor moisture resistance, immersion, etc., to reduce water absorption, The effect of prolonging the passing time and maintaining heat resistance and adhesiveness

Inactive Publication Date: 2017-03-22
HUIAN COUNTY GAOZHI MOLD TECH SERVICES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because after the introduction of multifunctional groups, the free volume of the packaging material also increases, resulting in an increase in water absorption. If the moisture resistance of the epoxy resin packaging material used is not good, the metal wiring of the package is easily corroded and passivated.
On the other hand, if the package is in a high-temperature and high-humidity environment, moisture will easily infiltrate from the interface or pores between the packaging material and the lead-out wire frame, causing bad defects such as loose wiring structure

Method used

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Examples

Experimental program
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Effect test

Embodiment Construction

[0008] (1) Take 5 grams of clay, add it to a 1L beaker filled with 500 ml of deionized water and stir for at least 6 hours to allow the clay to swell completely. Take 2.5 grams of tetradecyltrimethylammonium chloride (modifier), dissolve it in 100 ml of deionized water and stir, and add 1N HCl to adjust the pH of the solution between 3 and 4. After stirring for 1 hour, slowly add this solution dropwise to the clay solution, and after stirring overnight, centrifugally filter (9000rpm; 30min), remove the lower layer of clay, and then add it to a beaker containing 500 ml of deionized water and stir for 0.5 to 1 hour, then centrifuge and repeat this cleaning step 5 or 6 times. Finally, take out the lower layer of clay, put it in a vacuum oven at 40°C for about 1 to 2 days, until it is completely dry, and then pulverize it to obtain a lipophilic organically modified clay. (The modifier and the cations in the clay layer perform ion exchange, the modifier replaces the original catio...

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Abstract

A process for preparing a low water absorption epoxy resin type packaging material comprises the following steps: (1) taking 5 g of clay and 2.5 g of tetradecyl trimethylammonium chloride to prepare lipophilic organic modified clay; (2) adding 1g of bisphenol A diglycidyl ether and a proper amount of the clay, then adding 5 g of N, N-dimethylacetamide, then adding 1, 3-bis(3-aminopropyl)-1, 1, 3, 3-tetramethyldisiloxane, and forming a film at 120 DEG C for 5 hours. The packaging material prepared by the method can prolong water through time and effectively reduces water absorption rate because that water through paths are more winding due to layered arrangement of the clay dispersed in epoxy resin material.

Description

technical field [0001] The invention relates to a preparation process of a packaging material, in particular to a preparation process of a low water absorption epoxy resin type packaging material. Background technique [0002] At present, epoxy resin-based sealing materials account for about 90% of the entire circuit board sealing materials. As the performance of packaged devices increases, epoxy resins are required to have not only high heat resistance but also low water absorption. In order to improve the heat resistance of the packaging material, it is generally necessary to increase the cross-linking degree of the packaging material. The introduction of multifunctional groups is beneficial to improve the crosslinking degree of packaging materials. However, the introduction of multifunctional groups increases the water absorption of packaging materials. Because after the introduction of multifunctional groups, the free volume of the packaging material also increases, r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06C09C1/42C09C3/08C09K3/10
CPCC09J163/00C08K3/346C08K5/544C08K9/04C08L2203/206C09C1/42C09C3/08C09J11/04C09J11/06C09K3/10
Inventor 王婷婷
Owner HUIAN COUNTY GAOZHI MOLD TECH SERVICES
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