Process for preparing low water absorption epoxy resin type packaging material
A technology of epoxy resin and packaging materials, applied in the direction of epoxy resin glue, adhesive type, fibrous filler, etc., can solve the problems of loose wiring structure, poor moisture resistance, immersion, etc., to reduce water absorption, The effect of prolonging the passing time and maintaining heat resistance and adhesiveness
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[0008] (1) Take 5 grams of clay, add it to a 1L beaker filled with 500 ml of deionized water and stir for at least 6 hours to allow the clay to swell completely. Take 2.5 grams of tetradecyltrimethylammonium chloride (modifier), dissolve it in 100 ml of deionized water and stir, and add 1N HCl to adjust the pH of the solution between 3 and 4. After stirring for 1 hour, slowly add this solution dropwise to the clay solution, and after stirring overnight, centrifugally filter (9000rpm; 30min), remove the lower layer of clay, and then add it to a beaker containing 500 ml of deionized water and stir for 0.5 to 1 hour, then centrifuge and repeat this cleaning step 5 or 6 times. Finally, take out the lower layer of clay, put it in a vacuum oven at 40°C for about 1 to 2 days, until it is completely dry, and then pulverize it to obtain a lipophilic organically modified clay. (The modifier and the cations in the clay layer perform ion exchange, the modifier replaces the original catio...
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