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OLED display device package and packaging method

A display device and packaging method technology, which is applied in the manufacture of electric solid-state devices, semiconductor devices, semiconductor/solid-state devices, etc., can solve the problem that the water and oxygen barrier performance cannot fully meet the needs of large-size OLED display devices, and achieve the improvement of mechanical properties and Adhesive performance, blocking moisture and oxygen, and preventing corrosion

Inactive Publication Date: 2017-03-22
武汉船舶通信研究所
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problem that the water and oxygen resistance performance of OLED packaging in the prior art cannot fully meet the needs of large-size OLED display devices, an embodiment of the present invention provides an OLED display device packaging and packaging method

Method used

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  • OLED display device package and packaging method
  • OLED display device package and packaging method
  • OLED display device package and packaging method

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Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0072] The structure of the OLED display device package made in this embodiment is as follows: figure 2 shown, combined with figure 2 , this embodiment includes the following steps:

[0073] In the first step, a barrier layer 30 is formed on the flexible substrate 10. The barrier layer 30 includes an inorganic thin film layer, an organic thin film layer and a surface-modified inorganic thin film layer; the surface-modified inorganic thin film layer is surface-treated by an ion implantation process The inorganic thin film layer includes an inorganic thin film layer and an ion implantation layer injected into the surface of the inorganic thin film layer.

[0074] In the second step, an inorganic thin film layer 31 , an organic thin film layer 32 and an inorganic thin film layer 33 a are sequentially deposited on the OLED device 20 (cathode) prepared on the barrier layer 30 .

[0075] The third step is to use ion implantation technology to implant ions on the surface of the i...

Embodiment approach 2

[0078] The structure of the OLED display device package made in this embodiment is as follows: image 3 shown, combined with image 3 , this embodiment includes the following steps:

[0079] In the first step, a barrier layer 40 is formed on the flexible substrate 10, and the barrier layer includes a surface-modified inorganic thin film layer, a surface-modified organic thin film layer and a surface-modified inorganic thin film layer. The surface modified inorganic thin film layer includes an inorganic thin film layer and an ion implantation layer injected into the surface of the inorganic thin film layer; the surface modified organic thin film layer includes an organic thin film layer and an ion implantation layer injected into the surface of the organic thin film layer; the surface modified inorganic thin film layer includes an inorganic thin film layer. A thin film layer and an ion implantation layer implanted into the surface of the inorganic thin film layer.

[0080]In ...

Embodiment approach 3

[0085] The structure of the OLED display device package made in this embodiment is as follows: Figure 4 shown, combined with Figure 4 , this embodiment includes the following steps:

[0086] In the first step, ions are implanted on the flexible substrate 10a for surface modification, and a smooth and dense ion-implanted layer 10b is formed on the surface of the flexible substrate 10a.

[0087] In the second step, a barrier layer 50 is formed on the modified flexible substrate 10. The barrier layer 50 includes an inorganic thin film layer, an organic thin film layer and a surface modified inorganic thin film layer; the surface modified inorganic thin film layer includes an inorganic thin film layer and a surface modified inorganic thin film layer. The ion implantation layer implanted into the surface of the inorganic thin film layer.

[0088] In the third step, an inorganic thin film layer 51 , an organic thin film layer 52 and an inorganic thin film layer 53 a are sequenti...

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PUM

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Abstract

The invention discloses an OLED display device package and packaging method, and belongs to the technical field of display. The method includes manufacturing a barrier layer on a substrate; and after manufacturing an OLED device on the barrier layer, manufacturing a thin film packaging layer on the OLED device, wherein the thin film packaging layer is one whose surface is subjected to ion implantation technology treatment and covers the LED device and barrier layer, and the OLED device is located in a middle part of the barrier layer. The barrier layer is manufactured on the substrate, and the thin film packaging layer modified through the ion implantation technology is manufactured on the OLED device, thereby avoiding the problem that water and oxygen cause corrosion to the OLED device. The package provided by the invention is particularly suitable for packaging a flexible OLED display device.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an organic light-emitting diode (English Organic Light-Emitting Diode, OLED for short) display device packaging and packaging method. Background technique [0002] OLED display device is a display technology that uses organic semiconductor materials to emit light under the action of an electric field, and is a new type of pure solid-state display technology. [0003] OLED display devices are widely used in small electronic devices due to their advantages such as self-illumination (no backlight required), simple structure, ultra-thin, fast response, wide viewing angle, low power consumption, and flexible display. However, the promotion of large-size OLED display devices is still slow due to immature packaging technology and other reasons. [0004] At present, the mainstream OLED display device packaging method is organic thin film and inorganic thin film overlapping multi-layer ...

Claims

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Application Information

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IPC IPC(8): H01L51/52
CPCH10K50/8445H10K50/844
Inventor 张彬详黄楚佳刘阳陆飞
Owner 武汉船舶通信研究所