Cladding type quantum dot LED lamp bead packaging method

A technology of LED lamp beads and packaging method, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of difficulty in large-scale industrialization, low light conversion efficiency, complex process, etc., to reduce product defect rate, phosphor powder, etc. The effect of low concentration and high excitation efficiency

Inactive Publication Date: 2017-04-05
HUIZHOU JUFEI OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For this reason, the technical problem to be solved by the present invention is to overcome the technical bottleneck of the prior art which is complicated in technology, low in light conversion efficiency, high in cost, and difficult to realize large-scale industrialization, thereby proposing a kind of high color gamut value, avoiding the quantum dot Encapsulation method of phosphor powder, which is affected by external moisture, oxygen and high temperature of the chip, has high yield rate, and can be industrially produced in large quantities.

Method used

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  • Cladding type quantum dot LED lamp bead packaging method
  • Cladding type quantum dot LED lamp bead packaging method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] 1) Weigh 0.75g of phosphate red phosphor powder with an emission wavelength of 635nm, and weigh 0.04g of GaSe green quantum dot phosphor powder with an emission wavelength of 537nm, and place them in a container together.

[0034] 2) Weigh 1.50 g of epoxy resin, pour it into the luminescent material weighed in step 1), and carry out vacuum defoaming and stirring to obtain quantum dot fluorescent glue.

[0035] 3) Put the quantum dot fluorescent glue obtained in step 2) into an oven and bake at 150°C for 0.5h to cure the quantum dot fluorescent glue.

[0036] 4) The baked and cured fluorescent glue obtained in step 3) is placed in an agate mortar and ground, and the quantum dot fluorescent glue is ground into particles.

[0037] 5) Put the particles obtained in step 4) into a planetary ball mill, add an appropriate amount of alcohol to carry out wet ball milling, and control the speed of the ball mill to 240rpm. Dry at 60° C. after ball milling to obtain uniformly dispe...

Embodiment 2

[0042] 1) Weigh 0.17g of MgS red light quantum dot phosphor powder with an emission wavelength of 644nm, 0.10g of GaAs green light quantum dot phosphor powder with an emission wavelength of 541nm, and 0.58g of aluminate blue light phosphor with an emission wavelength of 458nm, together in a container.

[0043] 2) Weigh 2.00 g of epoxy resin, pour it into the luminescent material weighed in step 1), and carry out vacuum defoaming and stirring to obtain quantum dot fluorescent glue.

[0044] 3) Put the quantum dot fluorescent glue obtained in step 2) into an oven and bake at 120° C. for 1 hour to cure the quantum dot fluorescent glue.

[0045] 4) Put the baked and cured fluorescent glue obtained in step 3) into a stainless steel mortar and grind it to grind the quantum dot fluorescent glue into particles.

[0046] 5) Put the particles obtained in step 4) into a planetary ball mill, add an appropriate amount of alcohol to carry out wet ball milling, and control the speed of the ...

Embodiment 3

[0051] 1) Weigh 3.45g of fluoride red phosphor powder with an emission wavelength of 620nm, and weigh 0.12g of MgTe green quantum dot phosphor powder with an emission wavelength of 537nm, and place them in a container together.

[0052] 2) Weigh 2.75g of epoxy resin, pour it into the luminescent material weighed in step 1), and carry out vacuum defoaming and stirring to obtain quantum dot fluorescent glue.

[0053] 3) Put the quantum dot fluorescent glue obtained in step 2) into an oven and bake at 100° C. for 1 hour to cure the quantum dot fluorescent glue.

[0054] 4) The baked and cured fluorescent glue obtained in step 3) is placed in an agate mortar and ground for grinding, and the quantum dot fluorescent glue is ground into particles.

[0055] 5) Put the particles obtained in step 4) into a planetary ball mill, add an appropriate amount of alcohol to carry out wet ball milling, and control the speed of the ball mill to 2000rpm. After ball milling, dry at 40° C. to obtai...

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Abstract

The invention belongs to the LED backlight processing field, and specifically relates to a cladding type quantum dot LED lamp bead packaging method; the half-wave width of the employed quantum dot material is relatively narrow, thus greatly improving LED lamp bead color gamut value, and the color gamut value of the obtained LED lamp bead can be above NTSC93%; epoxy resin is used to wrap the quantum dot material in an early stage, thus isolating external moisture and oxygen from eroding the quantum dot material, and improving the lamp bead reliability; quantum dot phosphor is employed to obtain the white light LED lamp bead; the quantum dot phosphor is high in excitation efficiency, and the phosphor concentration is low in a packaging working process, thus reducing the packaging work difficulty and product fraction defective; the cladding type quantum dot LED lamp bead packaging method is suitable for mass industrialization production, and can provide great market prospect and economic values.

Description

technical field [0001] The invention belongs to the field of LED backlight processing, and in particular relates to a packaging method for a coated quantum dot LED lamp bead. Background technique [0002] Since the beginning of the 21st century, backlight technology has developed rapidly, and new technologies and products have been launched continuously. LED backlight has become the mainstream of the market. Compared with the traditional CCFL backlight, LED backlight has many advantages such as high color gamut, high brightness, long life, energy saving and environmental protection, real-time color controllable, etc., especially the high color gamut LED backlight makes TV, mobile phone, The screens of electronic products such as tablets have more vivid colors and a higher degree of color reproduction. At present, the commonly used LED backlight adopts the form of blue light chip to excite YAG yellow light phosphor. Due to the lack of red light component in the backlight, th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/50H01L33/56
CPCH01L33/504H01L33/507H01L33/56H01L2933/0041H01L2933/005
Inventor 张志宽高丹鹏邢其彬苏宏波王旭改
Owner HUIZHOU JUFEI OPTOELECTRONICS CO LTD
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