High temperature-resistant epoxy resin

A technology of epoxy resin and epoxy resin system, which is applied in the field of high-temperature resistant epoxy resin, can solve the problems of no longer usable performance, resin becoming brittle and hard, and decreased mechanical properties, so as to achieve excellent heat resistance and improve heat resistance. Performance, effect of modified volume shrinkage

Active Publication Date: 2017-04-19
SUZHOU SIRGEL RESINS SPECIALTIES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, in the field of high temperature, especially in the field of aerospace, the disadvantages of epoxy resin are highlighted. The use temperature of ordinary epoxy resin cured products is generally 80-100 ℃, and it will become soft, sticky, or even start to decomposed and no longer usable
By introducing rigid groups into the epo

Method used

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Embodiment 1

[0031] This embodiment discloses a high temperature resistant epoxy resin, the formula of which is shown in Table 1.

[0032] Epoxy resin formula table in the embodiment 1 of table 1

[0033] components Content (parts by weight) Multifunctional epoxy resin 100 Benzo six-membered heterocyclic compound 1 Anhydride curing agent 5 Methyl-bis(m-ethynylaniline)silane 80

Embodiment 2

[0035] This embodiment discloses a high temperature resistant epoxy resin, the formula of which is shown in Table 2.

[0036] Epoxy resin formulation table in table 2 embodiment 2

[0037] components Content (parts by weight) Multifunctional epoxy resin 100 Benzo six-membered heterocyclic compound 1 Anhydride curing agent 5 Methyl-bis(m-ethynylaniline)silane 80 Sea island toughener 0.5 Defoamer 0.1 Release agent 0.1

Embodiment 3

[0039] This embodiment discloses a high temperature resistant epoxy resin, the formula of which is shown in Table 3.

[0040] Epoxy resin formula table in the embodiment 3 of table 3

[0041]

[0042]

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Abstract

The invention discloses high temperature-resistant epoxy resin. The high temperature-resistant epoxy resin comprises 100 parts of epoxy resin, 1-30 parts of a benzo six-membered heterocyclic compound, 5-10 parts of a curing agent and 70-90 parts of phenylethynyl silane. The phenylethynyl silane includes methyl-di(m-ethynylaniline)silane, dimethyl-di(m-ethynylaniline)silane, methyl-tri(m-ethynylaniline)silane, phenyl-tri(m-ethynylaniline)silane and tetra(m-ethynylaniline)silane. The epoxy resin has multiple functional groups. The multi-functional group epoxy resin, the benzo six-membered heterocyclic compound and the curing agent are evenly mixed at first; and then phenylacetylene silane is added into the acetone environment, and an epoxy resin system can be obtained after even mixing is completed. According to the high temperature-resistant epoxy resin disclosed by the invention, the thermal performance is improved by means of modification; and moreover, the volume shrinkage is lowered, and the resin has a good mechanical property.

Description

technical field [0001] The invention relates to the field of epoxy resin materials, in particular to a high temperature resistant epoxy resin. Background technique [0002] Epoxy resin has good bonding performance due to its special three-membered ring structure of epoxy group, and epoxy resin has outstanding processability and design, so it is often used as a matrix of composite materials. In the low temperature field, epoxy resin is one of the most important composite material matrices, because epoxy resin, as a general-purpose thermosetting resin, has high mechanical properties, strong adhesion, small volume shrinkage, good process performance, and electrical insulation. Excellent performance, corrosion resistance and many other advantages, and has been widely used. [0003] However, in the field of high temperature, especially in the field of aerospace, the disadvantages of epoxy resin are highlighted. The use temperature of ordinary epoxy resin cured products is genera...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K5/544C08K5/00
CPCC08K5/00C08K5/544C08L2201/08C08L63/00
Inventor 张澜
Owner SUZHOU SIRGEL RESINS SPECIALTIES CO LTD
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