Method for preparing super-hydrophobic copper surface of plant leaf structure

A plant leaf, super-hydrophobic technology, applied in electroforming, electrolysis process, etc., can solve the problem of loss of multi-level complexity of the original template structure, no longer exist, etc., to achieve the effect of super-hydrophobicity

Inactive Publication Date: 2017-04-26
NANJING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Wang Tianchi et al. used lotus leaves as templates to prepare superhydrophobic carbon ceramic materials with excellent performance by dipping and sintering. However, these animal and plant leaf templates will lose part of their microstructure during the sintering process, such as lotus leaves after vacuum sintering. The microvilli on the surface no longer exist, and to a certain extent, the multilevel complexity of the original template structure is lost (Wang, T, et al. Hydrophobic properties of biomorphic carbon surfaces prepared by sintering lotus leaves. Ceram. Int. 2013, 39 ,8165–8172)

Method used

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  • Method for preparing super-hydrophobic copper surface of plant leaf structure
  • Method for preparing super-hydrophobic copper surface of plant leaf structure
  • Method for preparing super-hydrophobic copper surface of plant leaf structure

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Step 1: Put the lotus leaf in an oven at 100°C and dry it for 48 hours, then place it in an argon atmosphere furnace and heat it up to 800°C at a rate of 1°C / min to prepare a carbon template with the microstructure of the lotus leaf ;

[0021] Step 2, use the carbon template as the cathode electrode of the electrolytic cell, and perform electroplating in a copper sulfate solution, the concentration of the copper sulfate solution is 0.5mol / L, and the current density is 0.04A / cm 2 , the electroplating time is controlled to be 1min, and the copper surface with lotus leaf microstructure is obtained;

[0022] Step 3, immerse the copper-plated carbon template in a mixed solution of isopropanol and fluorosilane with a volume fraction of 20% fluorosilane, take it out after soaking for 6 days, and dry it to obtain a superhydrophobic copper surface with a lotus leaf microstructure ;

[0023] figure 1 To obtain the X-ray diffraction pattern of the copper surface, it can be seen...

Embodiment 2

[0025] Step 1: Put the lotus leaf in an oven at 80°C and dry it for 24 hours, then place it in an argon atmosphere furnace and heat it up to 600°C at a rate of 5°C / min to prepare a carbon template with the microstructure of the lotus leaf ;

[0026] Step 2, use the carbon template as the cathode electrode of the electrolytic cell, and perform electroplating in a copper sulfate solution, the concentration of the copper sulfate solution is 0.3mol / L, and the current density is 0.04A / cm 2 , control the electroplating time to be 5min, obtain the copper surface with lotus leaf microstructure;

[0027] Step 3, immerse the copper-plated carbon template in a mixed solution of isopropanol and fluorosilane with a volume fraction of 20% of fluorosilane, take it out after soaking for 5 days, and dry it to obtain a superhydrophobic copper surface with a lotus leaf microstructure . The contact angle of the superhydrophobic copper surface with water, θ 接触角 =151°, reaching superhydrophobici...

Embodiment 3

[0029] Step 1, put the zong leaves in an oven at 120°C, bake and dry for 24 hours, then place them in a nitrogen atmosphere furnace and heat them to 600°C at a heating rate of 2°C / min to prepare a carbon template with the microscopic structure of zong leaves;

[0030] Step 2, use the carbon template as the cathode electrode of the electrolytic cell for electroplating in copper sulfate solution, the concentration of copper sulfate solution is 0.1mol / L, and the current density is 0.03A / cm 2 , control electroplating time 5min, obtain the copper surface with the microstructure of Zongye;

[0031] Step 3, immerse the copper-plated carbon template on the surface in a mixed solution of isopropanol and fluorosilane with a volume fraction of 15% of fluorosilane, take it out after soaking for 10 days, and then dry it to obtain superhydrophobic copper with the microscopic structure of zongzi leaves surface. Figure 4 is the contact angle between the prepared superhydrophobic copper surf...

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Abstract

The invention discloses a method for preparing a super-hydrophobic copper surface of a plant leaf structure. The method comprises the steps of by taking a super-hydrophobic plant leaf as a preparation template, performing sintering in a non-oxidation atmosphere firstly to obtain a carbon template of a leaf structure; then electroplating a thin copper layer on the surface of the carbon template through an electroplating method to obtain the copper surface of the plant leaf structure; and modifying the copper surface by virtue of fluorine silane, which is a low surface energy substance so as to prepare the copper surface with a super-hydrophobic performance. The copper surface prepared through the method can well reserve the microstructure of the plant leaf, the nature is used as a reference in a high degree, film forming is conducted on the surface of the plant leaf template by adopting the electroplating method, and the surface structure roughness degree is increased through electroplating copper crystal grains, so that the copper surface has the excellent super-hydrophobic performance.

Description

technical field [0001] The invention belongs to the technical field of material preparation, and relates to a method for preparing a superhydrophobic copper surface with a plant leaf structure, in particular to a method for preparing a superhydrophobic copper surface with a plant leaf structure by electroplating. Background technique [0002] Copper and its alloys are the earliest and most widely used non-ferrous metals. They have good electrical and thermal conductivity. However, in copper parts for refrigeration, low-temperature operation and outdoor use, due to the high surface energy of copper, water molecules are easy to Adsorption and aggregation, it is easy to freeze, which seriously affects the thermal conductivity and electrical conductivity of copper products, and brings great harm to the stable operation of products and equipment. Most of the traditional anti-icing methods are based on the idea of ​​deicing and ice melting, such as thermal ice melting, overcurrent...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D1/04C25D3/38
CPCC25D1/04C25D3/38
Inventor 王天驰陈凯孔见赵一卓周哲刘子恒
Owner NANJING UNIV OF SCI & TECH
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