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A kind of inorganic superhydrophobic material and its preparation method and application

A super-hydrophobic and inorganic technology, applied in metal material coating process, vacuum evaporation plating, coating, etc., can solve the problems of poor temperature and corrosion resistance, achieve good temperature and corrosion resistance, and meet application requirements Effect

Active Publication Date: 2021-12-28
PEKING UNIV SHENZHEN GRADUATE SCHOOL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above deficiencies in the prior art, the object of the present invention is to provide an inorganic superhydrophobic material and its preparation method and application, aiming to solve the problem of poor temperature and corrosion resistance of existing organic superhydrophobic coatings

Method used

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  • A kind of inorganic superhydrophobic material and its preparation method and application
  • A kind of inorganic superhydrophobic material and its preparation method and application
  • A kind of inorganic superhydrophobic material and its preparation method and application

Examples

Experimental program
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Effect test

Embodiment 1

[0050] Embodiment 1: Preparation of inorganic superhydrophobic material

[0051] (1) Cleaning the sample: Sonicate a soda lime glass sheet with a size of 50×30×0.5 mm in deionized water and acetone for 30 min in sequence.

[0052] (2) Vacuuming: the sample is placed in a vacuum chamber, and the vacuum chamber of the magnetron sputtering equipment is evacuated to a vacuum degree of 3×10 through the pumping system. -3 Pa.

[0053] (3) Preparation of Cu film with micro / nano structure: feed Ar gas into the vacuum chamber, keep the Ar flow rate at 30sccm, keep the working pressure in the vacuum chamber at 0.8Pa, adopt magnetron sputtering to discharge the Cu target, the purity of the Cu target 99.8%, the size is 145×100×6mm, and the power density of the control power supply is 120W / cm 2 , the deposition rate is controlled at 1 μm / min.

[0054] (4) Cu / Cu 2 O / CuO micro-nanostructure surface preparation: the micro-nanostructure Cu film prepared by magnetron sputtering was oxidized...

Embodiment 2

[0056] Embodiment 2: preparation of inorganic superhydrophobic material

[0057] (1) Cleaning the sample: Sonicate a soda lime glass sheet with a size of 50×30×0.5 mm in deionized water and acetone for 30 min in sequence.

[0058] (2) Vacuuming: the sample is placed in a vacuum chamber, and the vacuum chamber of the magnetron sputtering equipment is evacuated to a vacuum degree of 3×10 through the pumping system. -3 Pa.

[0059] (3) Preparation of Cu film with micro / nano structure: feed Ar gas into the vacuum chamber, keep the Ar flow rate at 30sccm, keep the working pressure in the vacuum chamber at 0.8Pa, adopt magnetron sputtering to discharge the Cu target, the purity of the Cu target It is 99.8% pure, the size is 145×100×6mm, and the power density of the control power supply is 80W / cm 2 , the deposition rate is controlled at 800nm / min.

[0060] (4) Cu / Cu 2 O / CuO micro-nanostructure surface preparation: the micro-nanostructure Cu film prepared by magnetron sputtering w...

Embodiment 3

[0061] Embodiment 3: Preparation of inorganic superhydrophobic material

[0062] (1) Clean the sample: Sonicate a 304 stainless steel sheet with a size of 50×30×0.5 mm in deionized water and acetone for 30 minutes.

[0063] (2) Vacuuming: the sample is placed in a vacuum chamber, and the vacuum chamber of the magnetron sputtering equipment is evacuated to a vacuum degree of 3×10 through the pumping system. -3 Pa.

[0064] (3) Preparation of Cu film with micro / nano structure: feed Ar gas into the vacuum chamber, keep the Ar flow rate at 30sccm, keep the working pressure in the vacuum chamber at 0.8Pa, adopt magnetron sputtering to discharge the Cu target, the purity of the Cu target It is 99.8% pure, the size is 145×100×6mm, and the power density of the control power supply is 120W / cm 2 , the deposition rate is controlled at 1 μm / min.

[0065] (4) Cu / Cu 2 O / CuO micro-nanostructure surface preparation: the micro-nanostructure Cu film prepared by magnetron sputtering was oxid...

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Abstract

The invention discloses an inorganic super-hydrophobic material and a preparation method and application thereof, wherein the inorganic super-hydrophobic material comprises: a Cu film, a Cu film formed on the surface of the Cu film 2 At least one of an O film and a CuO film, the Cu film has a micro-nano structure, the Cu film 2 Both the O film and the CuO film have a (111) crystal plane. In the present invention, the composition distribution of the inorganic super-hydrophobic material is: Cu at the bottom of the micro-nano structure and Cu at the surface 2 at least one of O and CuO, and the Cu 2 Both O and CuO are mainly (111) planes. The (111) crystal plane has low surface energy, so that the material meets the two necessary conditions of micro-nano structure and low surface energy, so that the material has superhydrophobic properties. The inorganic super-hydrophobic material can achieve super-hydrophobicity without any modification or modification with organic substances, and the inorganic super-hydrophobic material also has better temperature and corrosion resistance, and can meet the application requirements of electronic devices and equipment.

Description

technical field [0001] The invention relates to the field of surface coating and electronic component equipment, in particular to an inorganic superhydrophobic material and its preparation method and application. Background technique [0002] Microelectronic components and devices are often used under relatively harsh environmental conditions. For example, static electricity, dust and corrosion caused by corrosive media such as marine environments will cause functional failure of microelectronic components and devices. Currently, although organic coatings are used for protection on conventional printed circuit boards, they still cannot meet the requirements of harsh environments in highly corrosive environments. And microelectronic components and devices have a continuous increase in power density and integration, and organic protective layers cannot meet the rapid heat dissipation requirements of metals or ceramics. [0003] At present, the superhydrophobic surface with a ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/35C23C14/16C23C14/18C23C14/58
CPCC23C14/35C23C14/165C23C14/185C23C14/5853
Inventor 吴忠振杨超安小凯唐伟
Owner PEKING UNIV SHENZHEN GRADUATE SCHOOL
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