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Electromagnetic shielding film and preparation method thereof

An electromagnetic shielding film and film technology, which is applied in the fields of magnetic field/electric field shielding, chemical instruments and methods, electrical components, etc., can solve the problems of poor electromagnetic shielding, complex production process, unfavorable industrial production, etc., and achieve the effect of improving shielding ability

Active Publication Date: 2017-04-26
昆山倬跃蓝天电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Aiming at the problems of insufficient contact between the metal layer and the conductive adhesive layer of the electromagnetic shielding film in the prior art, resulting in poor electromagnetic shielding performance, complex production process, and unfavorable industrial production, the present invention provides an electromagnetic shielding film and a preparation method thereof. The metal layer of the electromagnetic shielding film is fully in contact with the conductive adhesive layer, the conduction value is low, and the electromagnetic shielding performance is good. The preparation method has a simple production process and is beneficial to industrial production

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  • Electromagnetic shielding film and preparation method thereof
  • Electromagnetic shielding film and preparation method thereof
  • Electromagnetic shielding film and preparation method thereof

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preparation example Construction

[0054] The specific embodiment part of the present invention provides an electromagnetic shielding film, the electromagnetic shielding film includes a release film 1, a conductive adhesive layer 2, a metal layer 3, an insulating layer 4 and a carrier film 5 connected in sequence, and in the metal layer 3 Including metal particles, the metal particles are metal particles with regular geometry and ordered arrangement. Provide the preparation method of described electromagnetic shielding film simultaneously, described method comprises the following steps:

[0055] (1) One layer of ink is coated on one side of the carrier film 5 to form the ink insulating layer 4;

[0056] (2) The surface of the ink insulating layer 4 obtained in step (1) is coated with metal to obtain a metal layer 3;

[0057] (3) coating conductive glue on the surface of metal layer 3 obtained in step (2), to obtain conductive glue layer 2;

[0058] (4) The surface of the conductive adhesive layer obtained in ...

Embodiment 1

[0060] A kind of preparation method of electromagnetic shielding film, described method comprises the following steps:

[0061] (1) Coating a layer of ink on one side of the carrier film 5 (PET film) with a thickness of 10 μm, and drying it at 60° C. for 5 minutes to form an ink insulating layer 4 with a thickness of 7 μm;

[0062] (2) The surface of the ink insulating layer 4 obtained in step (1) is coated with copper at 1400° C. with an evaporation rate of 30 m / min by a true evaporation method to obtain a triangular 0.3 μm thick copper metal layer(3);

[0063] (3) The surface coating of the copper metal layer 3 obtained in step (2) contains polyacrylic resin conductive glue containing Ni powder, and is dried at 60° C. for 5 minutes to obtain a 5 μm thick conductive glue layer (2);

[0064] (4) The surface of the conductive adhesive layer obtained in step (3) is adhered and covered with a release film 1 (PET film) with a thickness of 10 μm to obtain an electromagnetic shield...

Embodiment 2

[0067] A kind of preparation method of electromagnetic shielding film, described method comprises the following steps:

[0068] (1) Coating a layer of ink on one side of the carrier film 5 (PEN film) with a thickness of 100 μm, and drying at 80° C. for 1 min to form an ink insulating layer 4 with a thickness of 11 μm;

[0069] (2) The surface of the ink insulation layer 4 obtained in step (1) is coated with silver at 1800° C. by vacuum evaporation method, under the condition of evaporation rate 75m / min, to obtain a trapezoidal 0.1 μm thick silver metal layer. (3);

[0070] (3) Coating conductive adhesive (epoxy resin) containing Co powder on the surface of the metal layer 3 obtained in step (2), drying at 80° C. for 1 min to obtain a 6 μm thick conductive adhesive layer (2);

[0071] (4) The surface of the conductive adhesive layer obtained in step (3) is adhered to a release film 1 (PE release film) with a thickness of 100 μm to obtain an electromagnetic shielding film.

[...

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Abstract

The invention relates to an electromagnetic shielding film which includes a release film 1, a conductive glue layer 2, a metal layer 3, an insulating layer 4 and a carrier film 5 which are successively connected. The metal layer 3 includes metal particles which have geometrical shapes and are orderly arranged. The metal layer and the conductive glue layer of the electromagnetic shielding film are in sufficient contact. The electromagnetic shielding film has low conductivity and excellent electromagnetic shielding properties. Also, the invention provides a preparation method for the electromagnetic shielding film. The preparation method has simple technologies and is conducive to industrial production.

Description

technical field [0001] The invention belongs to the field of shielding films, and in particular relates to an electromagnetic shielding film and a preparation method thereof. Background technique [0002] In recent years, with the widespread use of radio technology, electromagnetic pollution has become more and more common. At the same time, the use of low voltage and low power consumption of the circuit itself has significantly reduced the ability of the circuit itself to resist electromagnetic interference (EMI). The anti-EMI film is plated on the product shell, which can not only protect the product from the influence of external EMI, but also reduce its own interference to the outside world. The EU 89 / 336 / EEC (EMC) standard has clearly pointed out that electronic products must be plated on the inner wall of the product shell. Covered with anti-EMI film. The currently used shielding materials mainly include conductive type, filled type, intrinsic type and wave-absorbing ...

Claims

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Application Information

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IPC IPC(8): H05K9/00B32B7/06B32B27/06B32B27/08B32B27/28B32B27/30B32B27/32B32B27/36B05D7/04
CPCB05D7/04B32B7/06B32B27/08B32B27/281B32B27/285B32B27/302B32B27/308B32B27/32B32B27/36B32B27/365B32B2255/10B32B2255/205B32B2255/26B32B2255/28B32B2307/206B32B2307/212H05K9/0088
Inventor 闫勇高小君
Owner 昆山倬跃蓝天电子科技有限公司