Light and thin type black conductive adhesive film

Abstract

The invention discloses a light and thin type black conductive adhesive film. The light and thin type black conductive adhesive film comprises an upper conductive ink layer, a thin copper foil layer and a lower conductive ink layer; the thin copper foil layer is a copper foil layer, the thickness of which is 0.1-3 mum; both the upper conductive ink layer and the lower conductive ink layer are black conductive ink layers; the thin copper foil layer is positioned between the upper conductive ink layer and the lower conductive ink layer; the lower conductive ink layer contains multiple large conductive particles, the particle diameters of which are greater than the thickness of the lower conductive ink layer; and the large conductive particles pierce the lower conductive ink layer. The light and thin type black conductive adhesive film has the circuit shading function, the high electromagnetic wave shielding function and the high electric conductivity; furthermore, the large conductive particles in the light and thin type black conductive adhesive film have a piercing effect; the grounding effect can be perfectly realized when a grounding hole does not exist; furthermore, a ventilation hole can be formed; therefore, the delamination problem after SMT can be effectively solved; and machining operation of a downstream FPC factory can be easily carried out.

Description

technical field [0001] The invention belongs to the technical field of conductive adhesive for printed circuit boards, in particular to a black conductive adhesive with high electromagnetic wave shielding function and high conductivity. Background technique [0002] The rapid development of the electronic information industry has higher and higher requirements for the miniaturization and miniaturization of electronic components and the high density and high integration of printed circuit boards. In terms of functions, more and more powerful and high-speed signal transmission is required. With the improvement of line density and working bandwidth, coupled with the poor line layout in actual operation, the problem of Electromagnetic Interference (EMI) in the electronics industry is becoming more and more serious. The material or component of the effect makes a lot of sense. [0003] At present, the conductive adhesive or conductive material circulating in the market has the p...

AI Technical Summary

Problems solved by technology

With the improvement of line density and working bandwidth, coupled with the poor line layout in actual operation, the problem of Electromagnetic Interference (EMI) in the electronics industry is becoming more and more serious. The material or component of the effect makes sense

[0003] At present, the conductive adhesives or conductive materials circulating in the market have the problem of unstable glue overflow, which makes the processing and operation of downstream FPC factories difficult.

In addition, similar conductive materials currently on the market have the problem of board explosion after SMT.

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