Supercharge Your Innovation With Domain-Expert AI Agents!

Molybdenum wafer polishing device capable of recycling scraps

A wafer and chip technology, applied in the field of industrial processing equipment, can solve the problems of low efficiency, waste, and interference with the grinding effect of the device, and achieve the effect of excellent grinding effect, high efficiency, and high work efficiency

Inactive Publication Date: 2017-05-10
YIXING KEXING ALLOY MATERIAL
View PDF7 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the existing devices for grinding molybdenum discs still have certain defects in use, and the working efficiency of the device is not high, and powdery molybdenum disc debris is prone to appear in the grinding process. If these debris are not processed in time, Not only will it affect the normal operation of the device, but it will also interfere with the grinding effect, so that the surface smoothness of the polished molybdenum discs cannot meet the requirements, and the molybdenum disc debris has not been recycled and reused, which is wasteful

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Molybdenum wafer polishing device capable of recycling scraps
  • Molybdenum wafer polishing device capable of recycling scraps
  • Molybdenum wafer polishing device capable of recycling scraps

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0016] see Figure 1-3 As shown, a molybdenum disc grinding device capable of recovering debris includes a chassis 3, a top cover 1 is installed above the chassis 3, and a connecting block 2 is arranged on one side of the top cover 1, and several air holes 11 are arranged on the inner wall of the chassis 3, and The grinding disc 10 is installed at the bottom of the cabinet 3, and several grinding devices 9 are installed inside the cabinet 3. The grinding devic...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a molybdenum wafer polishing device capable of recycling scraps. The molybdenum wafer polishing device comprises a head cover, a connecting block, a chassis, a bottom box, a control cabinet, a control screen, a bracket, a supporting plate, a polishing device, an abrasive disk, an air hole, a first rotating disk, a second rotating disk, a connecting rod, a suction nozzle, a rotating rod, a water faucet, a rotating disk and a support rod. The molybdenum wafer polishing device disclosed by the invention has the beneficial effects that a plurality of symmetric polishing devices are arranged in the device, so that the device can polish a plurality of molybdenum wafers at the same time, and the working efficiency is high; the water outlet is arranged at one side of the rotating disk of each polishing device, the water continuously flows out from the water outlet along the outer side frame of the rotating disk so as to cool the rotating disk; and the scraps produced by grinding are taken away along the water flow, so that the polishing effect cannot be influenced by scraps sputtered or remained on the abrasive disk. The suction nozzle is arranged at one side of the water faucet for sucking the water discharged from the water faucet, and the polished scraps can be sucked along the water flow, and the recycled scraps can be collected and utilized.

Description

technical field [0001] The invention relates to a grinding device, in particular to a molybdenum disc grinding device capable of recovering debris, and belongs to the field of industrial processing equipment. Background technique [0002] Molybdenum is a metal element. Molybdenum has the characteristics of high temperature resistance. Adding molybdenum to alloy steel can improve the elastic limit, corrosion resistance and permanent magnetism of the metal. Therefore, it is mainly used in the steel industry, most of which Therefore, industrial molybdenum oxide is directly used for steelmaking or cast iron after briquetting, and is smelted into ferromolybdenum and molybdenum foil for steelmaking, and a small part is also used in the production of semiconductor power electronic devices. Among them, the packaging of ultra-high-power thyristors adopts a press-junction process, and the chips of high-voltage and high-current semiconductor devices are all matched with alloy molybdenu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B24B7/04B24B7/16B24B41/02B24B47/12B24B55/06B24B55/12
CPCB24B7/04B24B7/16B24B41/02B24B47/12B24B55/06B24B55/12
Inventor 俞叶赵占平
Owner YIXING KEXING ALLOY MATERIAL
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More