Molybdenum wafer polishing device capable of recycling scraps
A wafer and chip technology, applied in the field of industrial processing equipment, can solve the problems of low efficiency, waste, and interference with the grinding effect of the device, and achieve the effect of excellent grinding effect, high efficiency, and high work efficiency
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[0015] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0016] see Figure 1-3 As shown, a molybdenum disc grinding device capable of recovering debris includes a chassis 3, a top cover 1 is installed above the chassis 3, and a connecting block 2 is arranged on one side of the top cover 1, and several air holes 11 are arranged on the inner wall of the chassis 3, and The grinding disc 10 is installed at the bottom of the cabinet 3, and several grinding devices 9 are installed inside the cabinet 3. The grinding devic...
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