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Wheel type diamond knife scribing method

A diamond knife and scribing technology, which is applied in the direction of fine working devices, manufacturing tools, stone processing equipment, etc., can solve the problem of reducing the luminous efficiency of LED dies, the technology of laser scribing is not very mature, and the influence of optical performance of photosensitive devices, etc. problems, achieve good market application prospects, improve scribing quality and efficiency, and reduce scribing costs

Inactive Publication Date: 2017-05-10
NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the high hardness of the material, the wear of the grinding wheel tool is fast, which makes the scribing cost of the grinding wheel high. In order to ensure the cutting quality, the scribing speed needs to be reduced, so that the scribing efficiency is low; although the traditional diamond knife has high hardness, it uses point contact during the scribing process. It is also very fast, resulting in different scratch effects during the scribing process. In order to ensure the scribing quality, it needs to be constantly adjusted during the scribing process, so the scribing cost is high and the scribing efficiency is low; as a new type of scribing, laser scribing Compared with the previous two scribing methods, laser scribing technology has obvious advantages in terms of scribing efficiency and quality, but laser scribing also has thermal damage to the chip and has an impact on the optical performance of the photosensitive device (such as reducing the LED core Luminous efficiency, etc.), and the current laser scribing technology is not very mature, equipment is expensive and other factors limit its further promotion in the scribing field

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] A wheel type diamond knife scribing technology, comprising the following steps:

[0035] 1) Preparation: thin the SiC wafer to the target thickness of 60um and complete the backside process;

[0036] 2) Film attachment: use UV film to fix the SiC sheet that has completed the back process on the stretch ring;

[0037] 3) Scribing: Place the SiC wafer to be scribed on the MDI LS831 wheeled diamond scribing machine, vacuum it firmly, and scribing under the conditions of pressure 0.1~0.2MPa and speed 10~50mm / s;

[0038] 4) Fragmentation: Place the scribed SiC wafer on the Dynatex cleavage machine, set the hoof knife to coincide with the scratch setting and keep it still, set the pressure knife to the blank position of the scribing groove and press down 0.03~0.2mm for 50~300ms Then lift it up to complete a split action, repeat the above action until all scratch splits are completed;

[0039] 5) Fragmentation: Use a film expander to expand the chip spacing after the lobes, ...

Embodiment 2

[0041] The wheel type diamond knife scribing method comprises the following steps:

[0042] 1) Preparation: thin the GaN wafer to the target thickness of 100um and complete the backside process;

[0043] 2) Film: use blue film to fix the GaN flakes that have completed the back process on the stretch ring;

[0044] 3) Scribing: Place the GaN wafer to be scribed on the MDI LS831 wheeled diamond scribing machine, vacuum it firmly, and scribing under the conditions of pressure 0.15~0.35MPa and speed 10~200mm / s;

[0045] 4) Fragmentation: Place the scribed GaN wafer on the Dynatex fragmentation machine, set the hoof knife and the scratch setting to keep it still, set the pressure knife to the blank position of the scribing groove and press down 0.05~0.2mm for 100~200ms Then lift it up to complete a split action, repeat the above action until all scratch splits are completed;

[0046] 5) Fragmentation: Use a film expander to expand the chip spacing after the lobes to prevent debri...

Embodiment 3

[0048] The wheel-type diamond knife scribing technology includes the following steps:

[0049] 1) Preparation: Thinning the sapphire wafer to the target thickness (usually 100um) and completing the backside process;

[0050] 2) Film: Use UV film to fix the sapphire sheet that has completed the back process on the stretch ring;

[0051] 3) Scribing: Place the sapphire wafer to be scribed on the MDI LS831 wheeled diamond scribing machine, vacuum it firmly, and scribing under the conditions of pressure 0.2~0.4MPa and speed 50~100mm / s;

[0052] 4) Fragmentation: Place the sapphire disc that has been marked on the Dynatex splitter, set the hoof knife and the scratch setting to keep it still, set the pressure knife to the blank position of the scribing groove and press down 0.05~0.1mm for 100~200ms Then lift it up to complete a split action, repeat the above action until all scratch splits are completed;

[0053] 5) Fragmentation: Use a film expander to expand the chip spacing aft...

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Abstract

The invention discloses a wheel type diamond knife scribing method. The method includes the main steps that firstly, a wafer is thinned to a target thickness, and the back technology is completed; secondly, the wafer is fixed to a tensioning ring through an adhesive membrane; thirdly, a wheel type diamond knife is used for scribing of the water after the step, the pressure and the speed are set, and a groove is formed; fourthly, the wafer is subjected to splintering along the groove by means of a splintering machine; fifthly, the wafer is divided to form independent chips. The process has the advantages that diamond knife scribing is adjusted from traditional pen type scribing to wheel type scribing, and the problems that when a traditional diamond knife is used for scribing high-hardness semiconductor materials like SiC and GaN, the knife is large in loss, high in cost and low in efficiency can be well solved. Compared with adhesive wheel scribing and laser scribing, the diamond knife has larger advantages in the aspect of high-hardness semiconductor material scribing, and is wide in market application prospect.

Description

technical field [0001] The invention relates to a wheel-type diamond knife scribing method, which is not only suitable for scribing semiconductor materials with low hardness, but also suitable for scribing semiconductor materials with high hardness. It belongs to the technical field of semiconductor device manufacturing. Background technique [0002] With the development of science and technology, while electronic products improve people's daily life, they also make people more and more dependent on electronic products and have higher and higher requirements. The urgent development needs make the replacement cycle of electronic products shorter . Among them, semiconductor technology is the main driving force to promote the above changes, and is the core of the continuous development and progress of electronic products, which also makes people put forward more and more stringent requirements on the performance, quality and cost of semiconductor devices as the "heart" of elec...

Claims

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Application Information

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IPC IPC(8): B28D5/00
CPCB28D5/0017
Inventor 邹鹏辉高建峰黄念宁吴少兵王彦硕汤朦
Owner NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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