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Manufacturing method for soldered diamond wire saw

The invention relates to a diamond wire saw and a production method technology, which are applied in the tool manufacturing of sawing machine devices, metal sawing equipment, manufacturing tools, etc., can solve the problems of easy falling off of abrasives, short life of the wire saw, etc., and achieve full utilization and long tool life. , the effect of improving the bonding strength

Inactive Publication Date: 2020-05-08
南通曜世新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the abrasive is only mechanically embedded in the coating or resin bond, the abrasive is easy to fall off and the life of the wire saw is short

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The manufacture method of the brazed diamond wire saw of the present invention comprises the following steps:

[0022] 1) Mix the powdered Ni-Cr-B-Si solder with the green environmental protection liquid glue to form a slurry; the green environmental protection liquid glue includes the following components by weight: 3 parts of triphenyl phosphate, 50 parts of polyester, trihydroxy 20 parts of methyl propane, 20 parts of butanediol acrylate, 10 parts of acetone, 15 parts of polyisobutyl ester, 10 parts of polyimide, 8 parts of dibutyl phthalate, 25 parts of phenolic resin.

[0023] 2) The thickness of the solder slurry is moderate and uniformly adhered and fixed on the surface of the metal wire, and the thickness of the solder slurry adhered to the surface of the metal wire is 0.015mm.

[0024] 3) The diamond abrasive is evenly sprayed on the surface layer of the solder paste inlaid on the surface of the metal wire, and the particle size of the diamond abrasive is 15 μm...

Embodiment 2

[0027] The manufacture method of the brazed diamond wire saw of the present invention comprises the following steps:

[0028] 1) Mix the powdered Ni-Cr-B-Si solder with the green liquid adhesive to form a slurry; the green liquid adhesive includes the following components by weight: 8 parts of triphenyl phosphate, 60 parts of polyester, trihydroxy 40 parts of methylpropane, 30 parts of butanediol acrylate, 12 parts of acetone, 25 parts of polyisobutyl ester, 20 parts of polyimide, 18 parts of dibutyl phthalate, and 35 parts of phenolic resin.

[0029] 2) The thickness of the solder slurry is moderate and uniformly adhered and fixed on the surface of the metal wire, and the thickness of the solder slurry adhered to the surface of the metal wire is 0.020mm.

[0030] 3) The diamond abrasive is evenly sprayed on the surface layer of the solder paste inlaid on the surface of the metal wire, and the particle size of the diamond abrasive is 20 μm.

[0031] 4) Heating in an Ar gas pr...

Embodiment 3

[0033] The manufacture method of the brazed diamond wire saw of the present invention comprises the following steps:

[0034] 1) Mix the powdered Ni-Cr-B-Si solder with the green environmental protection liquid glue to form a slurry; the green environmental protection liquid glue includes the following components by weight: 5 parts of triphenyl phosphate, 55 parts of polyester, trihydroxy 30 parts of methyl propane, 25 parts of butanediol acrylate, 11 parts of acetone, 18 parts of polyisobutyl ester, 16 parts of polyimide, 12 parts of dibutyl phthalate, 30 parts of phenolic resin.

[0035] 2) The thickness of the solder slurry is moderate and uniformly adhered and fixed on the surface of the metal wire, and the thickness of the solder slurry adhered to the surface of the metal wire is 0.018mm.

[0036] 3) The diamond abrasive is evenly sprayed on the surface layer of the solder paste inlaid on the surface of the metal wire, and the particle size of the diamond abrasive is 18 μ...

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PUM

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Abstract

The invention discloses a manufacturing method for a soldered diamond wire saw. The manufacturing method comprises the following steps that powder-like Ni-Cr-B-Si solder and environment-friendly liquid glue are uniformly mixed into slurry; the solder slurry is moderate in thickness and uniformly adheres to the surface of a metal wire fixedly; a diamond abrasive material is uniformly sprayed onto asolder slurry surface layer inlaid on the surface of the metal wire; and heating is conducted under the Ar gas shield atmosphere till the solder is melted, and after cooling, the diamond abrasive material is soldered and fixed to the surface of the metal wire. According to the manufacturing method, the bonding strength of the diamond abrasive material is improved, the abrasive material is not prone to peeling off, and the service life of the wire saw is long.

Description

technical field [0001] The invention relates to a manufacturing method of a diamond wire saw, in particular to a manufacturing method of a brazed diamond wire saw. Background technique [0002] The traditional diamond wire saw is to fix a layer of diamond abrasive on the surface of the fine wire by electrodepositing nickel or thermosetting resin for precision cutting of materials. Since the abrasive is only mechanically embedded in the coating or resin bond, the abrasive is easy to fall off and the life of the wire saw is short. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a method for making a brazed diamond wire saw, which improves the bonding strength of the diamond abrasive, prevents the abrasive from falling off, and prolongs the life of the wire saw. [0004] In order to solve the above-mentioned technical problems, the present invention adopts the following technical solutions: the manufacturing method...

Claims

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Application Information

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IPC IPC(8): B23K1/00B23D65/00C09J167/00C09J11/06C09J11/08
CPCB23D65/00B23K1/0008B23K2101/20B23K2103/50C08L2205/035C09J11/06C09J11/08C09J167/00C08L61/06C08K5/523C08K5/053C08K5/12
Inventor 梅楼建
Owner 南通曜世新材料科技有限公司
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