Manufacturing method for soldered diamond wire saw
The invention relates to a diamond wire saw and a production method technology, which are applied in the tool manufacturing of sawing machine devices, metal sawing equipment, manufacturing tools, etc., can solve the problems of easy falling off of abrasives, short life of the wire saw, etc., and achieve full utilization and long tool life. , the effect of improving the bonding strength
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Embodiment 1
[0021] The manufacture method of the brazed diamond wire saw of the present invention comprises the following steps:
[0022] 1) Mix the powdered Ni-Cr-B-Si solder with the green environmental protection liquid glue to form a slurry; the green environmental protection liquid glue includes the following components by weight: 3 parts of triphenyl phosphate, 50 parts of polyester, trihydroxy 20 parts of methyl propane, 20 parts of butanediol acrylate, 10 parts of acetone, 15 parts of polyisobutyl ester, 10 parts of polyimide, 8 parts of dibutyl phthalate, 25 parts of phenolic resin.
[0023] 2) The thickness of the solder slurry is moderate and uniformly adhered and fixed on the surface of the metal wire, and the thickness of the solder slurry adhered to the surface of the metal wire is 0.015mm.
[0024] 3) The diamond abrasive is evenly sprayed on the surface layer of the solder paste inlaid on the surface of the metal wire, and the particle size of the diamond abrasive is 15 μm...
Embodiment 2
[0027] The manufacture method of the brazed diamond wire saw of the present invention comprises the following steps:
[0028] 1) Mix the powdered Ni-Cr-B-Si solder with the green liquid adhesive to form a slurry; the green liquid adhesive includes the following components by weight: 8 parts of triphenyl phosphate, 60 parts of polyester, trihydroxy 40 parts of methylpropane, 30 parts of butanediol acrylate, 12 parts of acetone, 25 parts of polyisobutyl ester, 20 parts of polyimide, 18 parts of dibutyl phthalate, and 35 parts of phenolic resin.
[0029] 2) The thickness of the solder slurry is moderate and uniformly adhered and fixed on the surface of the metal wire, and the thickness of the solder slurry adhered to the surface of the metal wire is 0.020mm.
[0030] 3) The diamond abrasive is evenly sprayed on the surface layer of the solder paste inlaid on the surface of the metal wire, and the particle size of the diamond abrasive is 20 μm.
[0031] 4) Heating in an Ar gas pr...
Embodiment 3
[0033] The manufacture method of the brazed diamond wire saw of the present invention comprises the following steps:
[0034] 1) Mix the powdered Ni-Cr-B-Si solder with the green environmental protection liquid glue to form a slurry; the green environmental protection liquid glue includes the following components by weight: 5 parts of triphenyl phosphate, 55 parts of polyester, trihydroxy 30 parts of methyl propane, 25 parts of butanediol acrylate, 11 parts of acetone, 18 parts of polyisobutyl ester, 16 parts of polyimide, 12 parts of dibutyl phthalate, 30 parts of phenolic resin.
[0035] 2) The thickness of the solder slurry is moderate and uniformly adhered and fixed on the surface of the metal wire, and the thickness of the solder slurry adhered to the surface of the metal wire is 0.018mm.
[0036] 3) The diamond abrasive is evenly sprayed on the surface layer of the solder paste inlaid on the surface of the metal wire, and the particle size of the diamond abrasive is 18 μ...
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