Muddy heat-conducting interface shimming material and preparation method thereof

A technology of gap-filling material and thermally conductive filler is applied in the field of mud-like thermally conductive interface gap-filling material and its preparation, which can solve the problems of increased labor cost pressure, reliability of component damage, and sensitivity of installation stress, so as to reduce labor requirements and reduce labor costs. The effect of protecting the device and high thermal conductivity

Inactive Publication Date: 2017-05-10
PINGHU ALLIED IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the continuous complexity of integrated circuits, the assembly density of electronic integrated boards increases, the heat generation density per unit area increases, and the functional components are miniaturized, which is more sensitive to installation stress, and it is easy to cause damage or damage to components due to excessive stress. Reliability declines, so traditional thermal silica sheets (thermal pads) can no longer meet current and future development needs
At the same time, with the increase of processing costs, the labor-intensive thermal pads can no longer meet the current cost requirements, and the labor cost pressure is increasing.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] A method for preparing a mud-like heat-conducting interface gap-filling material, comprising the following steps:

[0031] Step 1: Take 2g of silane coupling agent, 80g of isopropanol, and 0.2g of acetic acid to prepare a coupling agent dilution, and spray the coupling agent dilution evenly on the surface of spherical alumina with a particle size of 5um and 35um respectively, wherein, 5um spherical alumina is 186.4g, and 35um spherical alumina is 717.64g. During the spraying process, the spherical alumina is constantly stirred to make it fully contact with the coupling agent diluent, and it is placed in an oven at 110°C for drying operation to pre-treat the thermally conductive filler;

[0032] Step 2, sequentially add 50g of terminal vinyl silicone oil, 10g of polydimethylmethylvinylsiloxane, 2g of methyl hydrogen-containing silicone oil and 3g of titanate coupling agent into a double planetary mixer, and fully stir to make Polydimethylmethylvinylsiloxane is uniformly...

Embodiment 2

[0045] A method for preparing a mud-like heat-conducting interface gap-filling material, comprising the following steps:

[0046] Step 1: Take 3g of aluminate coupling agent, 110g of distilled water, and 0.1g of acetic acid to prepare a coupling agent dilution, and spray the coupling agent dilution evenly on the surface of spherical zinc oxide with a particle size of 10um and 40um respectively, wherein, 10um spherical zinc oxide is 161.64g, and 40um spherical zinc oxide is 862.08g. During the spraying process, the spherical zinc oxide is constantly stirred to make it fully contact with the coupling agent diluent, and it is placed in an oven at 120°C for drying operation to pre-treat the thermally conductive filler;

[0047] Step 2, sequentially add 84g terminal vinyl silicone oil, 24g polydimethylmethylvinylsiloxane, 3.6g methyl hydrogen-containing silicone oil and 5.4g aluminate coupling agent to the double planetary mixer, and fully stir , so that polydimethylmethylvinylsil...

Embodiment 3

[0060] A method for preparing a mud-like heat-conducting interface gap-filling material, comprising the following steps:

[0061] Step 1: Take 2 g of titanate coupling agent, 100 g of ethanol, and 0.1 g of acetic acid to prepare a coupling agent dilution, and spray the coupling agent dilution evenly on the surface of spherical alumina with a particle size of 5 um and 40 um respectively, wherein, 5um spherical alumina is 174.61g, and 40um spherical alumina is 656.07g. During the spraying process, the spherical alumina is constantly stirred to make it fully contact with the coupling agent diluent, and it is placed in an oven at 100°C for drying operation to pre-treat the thermally conductive filler;

[0062] Step 2, sequentially add 82g of terminal vinyl silicone oil, 28g of polydimethylmethylvinylsiloxane, 5g of methylhydrogen silicone oil and 7g of titanate coupling agent into a double planetary mixer, and fully stir to make Polydimethylmethylvinylsiloxane is uniformly dissol...

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Abstract

The invention discloses a muddy heat-conducting interface shimming material. The muddy heat-conducting interface shimming material comprises the following components by weight percentage: 5%-10% of vinyl silicone oil, 1%-5% of methyl vinyl silicone, 0.2%-0.7% of hydrogen-containing silicone oil, 0.1%-0.5% of a catalyst, 0.5%-1.3% of a coupling agent, and the balance of heat-conducting filler. The muddy heat-conducting interface shimming material has the higher heat conductivity coefficient, is capable of satisfying the heat-conducting requirements for sensitive apparatuses, greatly absorbing the instant stress generated during the installation, realizing the function of protecting devices, reducing the labor demand, and effectively improving the production efficiency and material user factor.

Description

technical field [0001] The invention relates to the technical field of heat-conducting materials, in particular to a mud-like heat-conducting interface gap-filling material used for installing stress-sensitive devices and a preparation method thereof. Background technique [0002] With the continuous complexity of integrated circuits, the assembly density of electronic integrated boards increases, the heat generation density per unit area increases, and the functional components are miniaturized, which is more sensitive to installation stress, and it is very easy to damage or damage the components due to excessive stress. Reliability has declined, so traditional thermal silicone sheets (thermal pads) can no longer meet current and future development needs. At the same time, with the increase of processing costs, the labor-intensive thermal pads can no longer meet the current cost requirements, and the labor cost pressure is increasing. Contents of the invention [0003] T...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08K13/06C08K9/06C08K7/18C08K3/22C08K5/10C08K3/38C08K3/28C09K5/14
CPCC08L83/04C08K2201/003C08K2201/014C08L2201/08C08L2203/20C08L2205/025C08L2205/03C09K5/14C08K13/06C08K9/06C08K7/18C08K2003/2227C08K5/10C08K2003/2296C08K2003/385C08K2003/282
Inventor 范勇
Owner PINGHU ALLIED IND
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