Drying device and cleaner with drying device

Abstract

The invention discloses a drying device and a cleaner with the drying device. The drying device comprises a frame, and a conveying belt, a fan, a gas supply pipe, a gas heating device and an air cutter module arranged on the frame; the fan is connected with the air cutter module through the gas supply pipe; the gas heating device is used for heating gas of the fan flowing through the gas supply pipe; and the air cutter module is near the conveying belt, and provides the gas heated by the gas heating device to products on the conveying belt. Through the mode, the drying device can dry the products by the heated gas so as to shorten the drying time and improve the drying efficiency.

Description

technical field [0001] The invention relates to the technical field of cleaning and drying of electronic devices, in particular to a drying device and a washing machine with the drying device. Background technique [0002] In the flip chip process, the chip needs to be cleaned with a cleaning machine after reflow soldering, mainly to remove the residual flux from the chip welding machine. Conventional flux cleaning machines usually include five areas: chemical cleaning area, cleaning area, rinsing area, final rinsing area and drying area. The drying area mainly dries the water on the surface of the product to ensure that there is no water on the surface of the product after cleaning. residual. [0003] The traditional drying area includes two parts: the air-drying area and the baking area. The air-drying area mainly uses the air knife to blow away the wind on the surface of the product. After the product passes through the air-drying area, some small water droplets will rem...

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Problems solved by technology

[0004] 1. The air-drying area mainly uses the dryer for drying operation, and the current dryer mainly blows cold air. Although the cold air can disperse the water on the surface of the product, it cannot dry the product and may leave watermarks. affect the appearance of the product;

[0005] 2. The baking area mainly adopts thermal radiation baking method, its baking efficiency is low, and it takes a long time to evaporate the water, and when the length of the baking area is fixed, the only way to ensure the drying of the product is to reduce the transmission speed effect, thereby reducing the production capacity of the equipment; and using thermal radiation baking, the surface of the product is also prone to watermark residue, which not only affects the appearance of the product, but also easily causes secondary pollution;

[0006] 3. Even after being dried by a dryer and heat radiation baking, the residual water in the gap between the chip and the substrate is still difficult to be completely evaporated

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