Medium-and-high temperature thick film circuit conductor paste and preparation method thereof

Abstract

The invention discloses a medium-and-high temperature thick film circuit conductor paste and a preparation method thereof. The conductor paste includes, by weight, 70% to 80% of conducting phase powder, 10% to 20% of organic vehicle, 2% to 8% of glass powder inorganic bonding phase and 2% to 5% of auxiliaries. The conducting phase powder is composed of silver powder, palladium powder, ruthenium pentoxide powder and iridium powder. The organic vehicle is composed of resin and solvent. The glass powder inorganic bonding phase is composed of Bi2O3, SiO2, Al2O3, ZnO, CuO, ZrO2 and B2O3. The conductor paste can be bonded to sintered medium paste well and is good in adherence and conducting performance, and meets requirements for conductor paste used for high power metal aluminum substrate thick film circuit. The preparation method includes the following technical steps of a, preparing the glass powder inorganic bonding phase; b, preparing the organic vehicle; c, preparing conductor paste. The preparation method can be used for producing the conductor paste effectively.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to a medium-high-temperature thick-film circuit conductor paste and a preparation method thereof. Background technique [0002] Thick film technology is to apply materials such as insulating dielectric paste, resistance paste and conductor paste on the substrate by screen printing, and then sinter at high temperature to form a functional film with strong adhesion on the substrate. [0003] At present, thick-film technology is widely used as high-power electric heating elements in the field of electric heating; among them, as the substrate of high-power electric heating elements, stainless steel substrates have the advantages of good mechanical properties and impact resistance, and are increasingly used in thick-film high-power Heating elements, and the corresponding electronic pastes are quite mature; however, the stainless steel substrate has a slow heating rate and hi...

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Problems solved by technology

[0003] At present, thick-film technology is widely used as high-power electric heating elements in the field of electric heating; among them, as the substrate of high-power electric heating elements, stainless steel substrates have the advantages of good mechanical properties and impact resistance, and are increasingly used in thick-film high-power Electric heating elements, and the matching electronic paste is quite mature; however, the stainless steel substrate has a slow heating rate and high density, resulting in bulky electric heating elements, high firing temperature of thick film circuit elements, and high energy consumption

[0004] The metal aluminum substrate has the advantages of light weight, only one-third of that of stainless steel, good thermal conductivity, and easy processing. It is very suitable for use as a high-power electric heating thick film circuit substrate; Commonly used electronic pastes do not match, and the melting point of aluminum is low, only about 660°C, so the traditional high-temperature sintering process cannot be used when firing electric heating elements

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