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Protective-coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating

A technology of protective film and sheet, which is applied in the direction of semiconductor/solid-state device manufacturing, semiconductor device, film/sheet adhesive, etc., to achieve the effect of stable manufacturing

Active Publication Date: 2017-05-10
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This results in a structure in which the back side of the semiconductor chip on which no circuit is formed is exposed.

Method used

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  • Protective-coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating
  • Protective-coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating
  • Protective-coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating

Examples

Experimental program
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Effect test

Embodiment 1

[0299] The following components were mixed according to the compounding ratio (in terms of solid content) shown in Table 1, and diluted with methyl ethyl ketone so that the solid content concentration became 50% by mass relative to the total mass of the coating agent for forming a protective film. A coating agent for a protective film forming film.

[0300] (A-1) Adhesive polymer: 10 parts by mass of n-butyl acrylate, 70 parts by mass of methyl acrylate, 5 parts by mass of glycidyl methacrylate and 15 parts by mass of 2-hydroxyethyl acrylate ( 100 parts by mass of meth)acrylate copolymer (weight average molecular weight: 400,000, glass transition temperature: -1°C)

[0301] (A-2) Adhesive polymer: (meth)acrylate copolymer formed by copolymerization of 85 parts by mass of methyl acrylate and 15 parts by mass of 2-hydroxyethyl acrylate (weight average molecular weight: 400,000, glass transition Temperature: -6°C)

[0302](A-3) Adhesive polymer: 55 parts by mass of n-butyl acry...

Embodiment 2

[0318] The type and compounding amount of each component constituting the protective film forming film were adjusted according to the column of Example 2 in Table 1, and the composition was adjusted with methyl ethyl ketone so that the solid content concentration was 50%, and the coating for protective film forming film was prepared. Except for the cloth agent, it carried out similarly to Example 1, and manufactured the sheet|seat for protective film formation.

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Abstract

A protective-coating-forming sheet (3) provided with a first support sheet (4) and a protective-coating formation film (1) layered on a first surface side of the first support sheet (4), the protective-coating formation film (1) comprising a curable material, and the protective-coating formation film (1) having the following characteristics: when the protective-coating formation film (1) is cured and a protective coating is obtained, the breaking strain of the protective coating at 50 DEG C is 20% or less, and the breaking stress thereof at 50 DEG C is 2.0*107 Pa or less.

Description

technical field [0001] The present invention relates to a sheet for forming a protective film capable of forming a protective film on a workpiece such as a semiconductor wafer or a processed product obtained by processing the workpiece (for example, a semiconductor chip). [0002] This application claims the priority of Japanese Patent Application No. 2014-169266 and Japanese Patent Application No. 2014-169267 filed in Japan on August 22, 2014, and uses the contents thereof here. Background technique [0003] In recent years, semiconductor devices have been manufactured using a mounting method called a so-called face down method. In this method, when mounting a semiconductor chip having a circuit surface on which electrodes such as bumps are formed, the circuit surface side of the semiconductor chip is bonded to a chip mounting portion such as a lead frame. This results in a structure in which the back side of the semiconductor chip on which no circuit is formed is exposed....

Claims

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Application Information

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IPC IPC(8): B32B27/00B23K26/53C09J7/02H01L21/301C09J7/20
CPCB32B27/00B23K26/53H01L2224/83192C09J7/20B32B7/12B32B27/06H01L21/56H01L21/6836H01L21/78
Inventor 山本大辅佐伯尚哉米山裕之
Owner LINTEC CORP