Adhesive composition, anisotropic conductive film, and semiconductor device using same
An anisotropic and compositional technology, applied to the conductive layer, adhesive, adhesive type, etc. on the insulating carrier, can solve the problems of cationic polymerizable epoxy resin composition stability degradation, etc., to achieve improved storage stability , fast curing effect
Active Publication Date: 2017-05-10
KUKDO ADVANCED MATERIALS CO LTD
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example 1
[0079] In the preparation of the adhesive composition, 5 parts by weight of a thermally curable cationic polymerization catalyst ( SI-B3A, Japan Sanshin Chemical Industry Co., Ltd.), and 5 parts by weight of the compound (SI-S, Japan Sanshin Chemical Industry Co., Ltd. ) was dissolved in PGMEA as solvent.
example 2
[0081] Adhesive composition is prepared in the same manner as in Example 1, except that Celoxide 2081 (EEW: 200 grams / equivalent, Japan Daicel Chemical Industry Co., Ltd.) is used instead of SER-2001 as alicyclic epoxy resin .
example
[0097] Example: Preparation of anisotropic conductive film
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Abstract
The present invention relates to: an adhesive composition containing a cycloaliphatic epoxy resin, of which the heating peak temperature by thermal differential scanning calorimetry is 60 DEG C to 105 DEG C, a cationic polymerization catalyst of chemical formula 1, and a compound of chemical formula 2; an anisotropic conductive film using the same; and a semiconductor device connected by the anisotropic conductive film.
Description
technical field [0001] The present invention relates to an adhesive composition, an anisotropic conductive film, and a semiconductor element using the same. Background technique [0002] In general, anisotropic conductive film (ACF) refers to a film-shaped adhesive prepared by dispersing conductive particles in a resin such as epoxy resin. The anisotropic conductive film is composed of a polymer layer having electrical anisotropy and adhesiveness, and exhibits conductive properties in the film thickness direction and insulating properties in the surface direction thereof. [0003] The anisotropic conductive film is used for electrical connection between electrodes on circuit boards such as FPC (flexible printed circuit board), TAB (tape automated bonding board), PCB ( printed circuit boards), glass circuit boards, and the like. [0004] Such anisotropic conductive films are composed of cationically polymerizable epoxy resin compositions. The cationically polymerizable epo...
Claims
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IPC IPC(8): C09J163/00C09J11/06C09J7/02H01B5/14C09J7/20
CPCC09J11/06C09J163/00H01B5/14C09J7/20C08G59/24C08G59/4064C08G59/72C08J5/18C08K2201/001
Inventor 朴憬修金智软朴永祐孙秉勤申炅勳申颍株郑光珍韩在善黄慈英
Owner KUKDO ADVANCED MATERIALS CO LTD
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