Negative photosensitive resin composition, resin cured film, partition wall and optical element

A technology of photosensitive resin and composition, which is applied in the direction of optics, electrical components, electric solid devices, etc., can solve the problems of difficult high sensitivity, insufficient liquid repellency, etc., and achieve the effect of reducing residue

Active Publication Date: 2020-06-16
AGC INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the composition in Patent Document 2 is difficult to achieve high sensitivity and has insufficient liquid repellency

Method used

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  • Negative photosensitive resin composition, resin cured film, partition wall and optical element
  • Negative photosensitive resin composition, resin cured film, partition wall and optical element
  • Negative photosensitive resin composition, resin cured film, partition wall and optical element

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0263] Hereinafter, although this invention is demonstrated based on an Example, this invention is not limited to these Examples. Examples 1-10 are examples, and Examples 11-13 are comparative examples.

[0264] Each measurement was performed by the following method.

[0265] [number average molecular weight (Mn), mass average molecular weight (Mw)]

[0266] The number average molecular weight (Mn) and the mass average molecular weight (Mw) were measured by gel permeation chromatography using polystyrene as a standard substance. As the gel permeation chromatography, HPLC-8220GPC (manufactured by Tosoh Corporation) was used. As a column, a column connected with three pieces of Shodex LF-604 was used. As a detector, an RI detector is used. As a standard substance, EasiCal PS1 (manufactured by Polymer Laboratories) was used. Furthermore, when measuring the number average molecular weight and mass average molecular weight, the column was kept at 37° C., tetrahydrofuran was us...

Synthetic example 1

[0335] (Synthesis example 1: Synthesis of ink repellent agent (E-1))

[0336] In inner volume 1,000cm equipped with mixer 3 420.0g of MEK, 99.0g of C6FMA, 9.0g of MAA, 18.0g of 2-HEMA, 45.0g of MMA, 9.0g of IBMA, 3.0g of polymerization initiator V-65 and 5.0g of DSH were put into the autoclave of It was polymerized at 50° C. for 24 hours while stirring, and then heated at 70° C. for 5 hours to deactivate the polymerization initiator to obtain a solution of a copolymer (ink repellent agent (E-1)) (solid content concentration; 30 mass %). This solution was used for manufacture of the negative photosensitive resin composition mentioned later. It should be noted that in the synthesis of the following ink repellent agent, for the case of obtaining the ink repellent agent in the state of a solution containing the ink repellent agent, after measuring or adjusting the solid content concentration, the state of the solution is used for negative photosensitive Manufacture of permanent...

Synthetic example 2

[0338] (Synthesis Example 2: Synthesis of Ink Repellent (E-2))

[0339] In inner volume 1,000cm equipped with mixer 3 415.1g of MEK, 1.0g of C6FMA, 18.0g of MAA, 81.0g of 2-HEMA, 5.0g of polymerization initiator V-65 and 4.7g of DSH were put into the autoclave of the After polymerization for 24 hours, it was heated at 70° C. for 5 hours to inactivate the polymerization initiator to obtain a copolymer solution. The number average molecular weight of the copolymer was 5540, and the mass average molecular weight was 13200.

[0340] Then, in the inner volume of 300cm equipped with mixer 3 130.0 g of the solution of the above-mentioned copolymer, 33.5 g of BEI, 0.13 g of DBTDL, and 1.5 g of TBQ were charged into an autoclave made of the above, and reacted at 40° C. for 24 hours while stirring to synthesize a crude polymer. After adding hexane to the obtained crude polymer solution and carrying out reprecipitation purification, it vacuum-dried and obtained the ink repellent agent...

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Abstract

The present invention provides a negative-type photosensitive resin composition for producing optical elements (organic EL elements, quantum dot displays, TFT arrays, thin-film solar cells), etc., which have good ink repellency on the upper surface of partition walls and can reduce residues in openings , a resin cured film for an optical element having good ink repellency on the upper surface, a partition wall for an optical element capable of forming a fine and highly precise pattern, and the above-mentioned optical element having the partition wall. Provided are a negative photosensitive resin composition, a cured film and a partition formed using the negative photosensitive resin composition, and the above-mentioned optical element, wherein the negative photosensitive resin composition is characterized in that it contains a photocurable alkali-soluble A resin or an alkali-soluble monomer, a photopolymerization initiator, an acid generator, an acid curing agent, and an ink repellent, and the optical element has a plurality of dots on the surface of the substrate and the partition walls between adjacent dots.

Description

technical field [0001] The present invention relates to a negative photosensitive resin composition, a resin cured film, a partition wall and an optical element for manufacturing optical elements such as an organic EL element, a quantum dot display, a TFT array, and a thin-film solar cell, and specifically relates to an organic EL element , quantum dot displays, TFT arrays and thin-film solar cells, etc. Background technique [0002] In the manufacture of optical elements such as organic EL (Electro-Luminescence) elements, quantum dot displays, TFT (Thin Film Transistor) arrays, and thin-film solar cells, it is sometimes used to pattern organic or inorganic layers such as light-emitting layers by the inkjet (IJ) method. Method of printing as dots. In this method, partition walls are provided along the outline of dots to be formed, and ink containing an organic layer or an inorganic layer material is injected into a section (hereinafter, also referred to as an "opening") sur...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/038G03F7/004G03F7/027H01L21/336H01L29/786H01L31/18H01L51/50H05B33/10H05B33/22
CPCG03F7/004G03F7/027G03F7/038H01L29/786H01L31/18H05B33/10H05B33/22G03F7/0382
Inventor 高桥秀幸山田光太郎
Owner AGC INC
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