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Electroless copper plating solution

A technology of electroless copper plating and plating solution, which is applied in the field of electroless copper plating solution, which can solve the problems of environment and operator hazards, and achieve the effects of less environmental pollution, good bonding force of the plating layer, and low production cost

Inactive Publication Date: 2017-05-17
TIANJIN RUISAIKE NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Electroless copper plating plays a very good role in protecting and decorating the plating surface, but it is known that the electroless copper plating solution is extremely harmful to the environment and operators

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0010] An electroless copper plating solution made from the following concentrations of raw materials: CuSO 4 6g / L, CoSO 4 0.6g / L, EDTA 9g / L, HEDP 1g / L, sodium hypophosphite 9g / L, thiourea 0.004g / L, methanol or thiourea or alkylmercaptan or dihydroxyazepine 1g / L. Electroplating conditions are pH 1~4, temperature 40~80°C.

Embodiment 2

[0012] An electroless copper plating solution made from the following concentrations of raw materials: CuSO 4 6g / L, CoSO 4 0.6g / L, EDTA 9g / L, HEDP 1g / L, sodium hypophosphite 9g / L, thiourea 0.004g / L, methanol or thiourea or alkylmercaptan or dihydroxyazepine 1g / L. Electroplating conditions are pH 1~4, temperature 40~80°C.

Embodiment 3

[0014] An electroless copper plating bath made from raw materials at the following concentrations:

[0015] CuSO 4 6g / L, CoSO 4 0.6g / L, EDTA 9g / L, HEDP 1g / L, sodium hypophosphite 9g / L, thiourea 0.004g / L, methanol or thiourea or alkylmercaptan or dihydroxyazepine 1g / L. Electroplating conditions are pH 1~4, temperature 40~80°C.

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PUM

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Abstract

The invention provides an electroless copper plating solution. On a concentration basis, the electroless copper plating solution is made of the following raw materials of 6 g / L of CuSO4, 0.6 g / L of CoSO4, 9 g / L of EDTA, 1 g / L of HEDP, 9g / L of sodium hypophosphite, 0.004 g / L of thiourea, and 1 g / L of methyl alcohol or thiocarbamide or alkyl sulfhydryl or dihydroxy pyridine. According to the electroplating conditions, pH is 1-4, and the temperature is 40-80 DEG C. By means of the electroless copper plating solution provided by the invention, a plating layer has the advantages of being good in bonding force, better in brightness, small in toxicity, small in environment pollution, simple in process operation, low in production cost and the like, and a novel process replacing cyanide copper plating is provided.

Description

technical field [0001] The invention relates to an electroless copper plating solution. Background technique [0002] Electroless copper plating plays a very good role in protecting and decorating the plating surface, but it is known that the electroless copper plating solution is extremely harmful to the environment and operators. There is an urgent need to find a new process that is environmentally friendly, efficient, easy to operate, and low in cost to replace the traditional cyanide copper plating. Contents of the invention [0003] Aiming at the deficiencies in the prior art, the technical problem to be solved by the present invention is to provide an electroless copper plating bath, which has good coating adhesion, better brightness, low toxicity, low environmental pollution, simple process operation, low production cost, etc. The advantage is that it is a new process to replace cyanide copper plating. [0004] In order to solve the above-mentioned technical probl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/40
Inventor 宋振兴谢玉娟
Owner TIANJIN RUISAIKE NEW MATERIAL TECH CO LTD
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