Mixed lithographic system and mixed lithographic method

Abstract

A mixed lithographic system comprises a light source, a beam shaper, a light field modulator, a mirror, an imaging optical system and a phase element, wherein the beam shaper is used for shaping beams emitted by the light source; the light field modulator is used for generating graphic light from the shaped beams; the imaging optical system and the mirror are used for transmitting a light field to the surface of a to-be-exposed lithographic piece to realize direct writing lithography; the phase element is used for forming an interference exposure field on the surface of the lithographic piece to realize interference lithography. The mixed lithographic system has direct writing lithography and interference lithography functions, can perform mixed lithography, increases the nano-lithography efficiency and has great significance in promoting application of micro-nano structure related devices and materials. The invention further relates to a mixed lithographic method.

Description

technical field [0001] The invention relates to the technical field of micro-nano manufacturing, and relates to a patterned hybrid photolithography system and a hybrid photolithography method for preparing micro-nano molds. Background technique [0002] Patterned lithography is a common front-end process in the field of micro-nano manufacturing. It is currently widely used in industries such as flat panel display, integrated circuits, flexible circuits, and new materials. [0003] Facing different application fields, the preparation requirements of micro-nano structures are different, the format ranges from 4 inches to 100 inches, and the micro-structures range from 10 nanometers to tens of microns. The current technical status is that electron beam plate-making is used for nanometer to sub-micron scale structures, and the format cannot be enlarged. Laser beam plate-making is used for several-micron to tens of micron-scale structures, and the format can be enlarged, but the ...

AI Technical Summary

Problems solved by technology

The current technical status is that electron beam plate-making is used for nanometer to sub-micron scale structures, and the format cannot be enlarged. Laser beam plate-making is used for several-micron to tens of micron-scale structures, and the format can be enlarged, but the sub-micron structure cannot be realized. Large format plate making requirements

[0004] The current micro-nano application field is extending from semiconductors and flat panel displays to the field of metamaterials (artificial microstructure materials), which requires large-format plate-making with sub-micron structures, and the current graphic preparation methods cannot meet such needs

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