Hybrid lithography system and hybrid lithography method

Abstract

A hybrid lithography system (10) and a hybrid lithography method. The system comprises a light source (11), a light beam shaper (12), a light-field modulator (13), a reflector (14), an imaging optical system and a phase device (15), wherein the beam shaper (12) is used for shaping light beams emitted by the light source (11). the light-field modulator (13) is used for generating pattern light with the shaped light beams; the imaging optical system and the reflector (14) are used for transferring a light field to the surface of a lithographic member (101) to be exposed, so as to realize direct writing lithography; and the phase device (15) is used for forming an interference exposure field on the surface of the lithographic member (101), so as to realize interference lithography. The hybrid lithography system (10) has two functions of direct writing lithography and interference lithography, and can perform hybrid lithography, thereby improving the nanometre lithography efficiency and having great significance in promoting the application of devices and materials related to micro-nano structures.

Description

technical field [0001] The invention relates to the technical field of micro-nano manufacturing, and relates to a patterned hybrid photolithography system and a hybrid photolithography method for preparing micro-nano molds. Background technique [0002] Patterned lithography is a common front-end process in the field of micro-nano manufacturing. It is currently widely used in industries such as flat panel display, integrated circuits, flexible circuits, and new materials. [0003] Facing different application fields, the preparation requirements of micro-nano structures are different, the format ranges from 4 inches to 100 inches, and the micro-structures range from 10 nanometers to tens of microns. The current technical status is that electron beam plate-making is used for nanometer to sub-micron scale structures, and the format cannot be enlarged. Laser beam plate-making is used for several-micron to tens of micron-scale structures, and the format can be enlarged, but the ...

AI Technical Summary

Problems solved by technology

The current technical status is that electron beam plate-making is used for nanometer to sub-micron scale structures, and the format cannot be enlarged. Laser beam plate-making is used for several-micron to tens of micron-scale structures, and the format can be enlarged, but the sub-micron structure cannot be realized. Large format plate making requirements

[0004] The current micro-nano application field is extending from semiconductors and flat panel displays to the field of metamaterials (artificial microstructure materials), which requires large-format plate-making with sub-micron structures, and the current graphic preparation methods cannot meet such needs

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