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Low-melting-point alloy for automobile tire mould

A technology of automobile tires and low melting point, which is applied in the field of low melting point alloys to achieve the effect of clear molding, fast molding and easy melting

Active Publication Date: 2017-05-24
LICHUANG TAISHAN ELECTRONICS TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the manufacture of tire molds requires high hardness, fast manufacturing speed and high precision, but the current traditional low-melting bismuth-tin alloys are difficult to meet these requirements

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Embodiment 1: A kind of low-melting-point alloy for automobile tire molds, comprising the following components by weight percentage: Bi 58%, Ni 0.055%, Ce 0.01%, the balance being Sn and impurities less than 0.05%.

[0027] The low-melting point alloy made by the above weight percentage has high density, high plasticity and certain oxidation resistance at high temperature, and the surface quality of the alloy after casting is better.

Embodiment 2

[0028] Embodiment 2: A low-melting-point alloy for automobile tire molds, comprising the following components by weight percentage: Bi 40%, Ni 0.03%, Ce 0.005%, Ge 0.01%, the balance being Sn and impurities less than 0.05%.

[0029] The low melting point alloy made by the above weight percentage has high density, high plasticity and strong oxidation resistance at high temperature, and the surface quality of the alloy after casting is high.

Embodiment 3

[0030] Embodiment 3: A kind of low-melting-point alloy for automobile tire molds, comprising the following components by weight percentage: Bi60%, Ni 0.1%, Ce 0.005%, Ge 0.015%, the balance being Sn and impurities less than 0.05%.

[0031] The low melting point alloy made by the above weight percentage has high density, high plasticity and strong oxidation resistance at high temperature, and the surface quality of the alloy after casting is high.

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PUM

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Abstract

The invention discloses a low-melting-point alloy for an automobile tire mould. The low-melting-point alloy for the automobile tire mould is prepared from the following components in percentage by weight: 20 percent to 70 percent of Bi, 0 percent to 0.5 percent of Ni, 0 percent to 1 percent of Ce, 0 percent to 1 percent of Ge, and the balance of Sn and less than 0.05 percent of impurities. The low-melting-point alloy for the automobile tire mould has a good flowing property, a stable recasting performance, no toxicity, no harm to an operator, and no pollution to the environment when being used for casting the mould; the low-melting-point alloy is the poly eutectic alloy, which is low in melting point, easy to melt, convenient to mould, high in alloy strength, and long in mould service life so as to have higher economic benefit.

Description

[0001] Technical field: [0002] The invention relates to a low-melting-point alloy for automobile tire molds, and relates to the technical field of mold metal preparation. [0003] Background technique: [0004] In today's fast-growing mold industry, the usage of tin-bismuth alloy is huge. People take advantage of the advantages of low melting point, good fluidity, convenient casting, no shrinkage and reusable materials of bismuth-tin alloy materials. They are used in the automobile tire manufacturing industry and play an irreplaceable role in the automobile tire manufacturing industry. Due to the low melting point and good fluidity of traditional tin-bismuth alloys, casting methods can be used to make molds. The mold-making cycle is short and the machining hours are less, especially for drawing dies with complex shapes. Its advantages are more obvious. After the bismuth-tin low-melting point alloy mold is used, it can be remelted and cast into a new mold, thus saving a lot o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C13/02C22C1/03
CPCC22C1/03C22C13/02
Inventor 梁力强何锡坚范晶波梁洁明
Owner LICHUANG TAISHAN ELECTRONICS TECH