Exposure device and method

Abstract

The invention discloses an exposure device. The exposure device comprises an exposure unit used for preforming exposure on a wafer, wherein the exposure unit comprises an illuminating system and masks, and the illuminating system comprises a dodging unit. The exposure device is characterized in that the dodging unit comprises orthohexagonal dodging quartz rods; and each mask is in an orthohexagonal shape matched with that of each orthohexagonal dodging quartz rod. Through the adoption of the exposure device disclosed by the invention, under the situation of the same exposure field of view, the influence of field curvature of an objective lens on depth of focus is reduced, and the depth of focus, which can be used in practice, is increased; and under the situation of the same depth of focus of projection objective lenses, the exposure area of the exposure field of view is expanded.

Description

technical field [0001] The present invention relates to a lithography apparatus, in particular to an exposure device and method. Background technique [0002] A lithographic apparatus is a machine that applies a desired pattern to a substrate, usually a target portion of the substrate. For example, lithographic apparatuses can be used in the manufacture of integrated circuits. In this case, a patterning device, which may be considered a mask or reticle, is used to generate a circuit pattern corresponding to a single layer of the integrated circuit. The pattern can be imaged onto a target portion (eg, including a portion of a die, one or more dies) on a substrate (eg, a silicon wafer). In particular, in the field of LED manufacturing, it is first necessary to image the dense hole pattern onto the patterned sapphire substrate. [0003] Compared with the imaging of lines, the imaging of dense holes or dense cylinders will be much more difficult, and the actual depth of focus...

AI Technical Summary

Problems solved by technology

Please refer to figure 2 , the mask 20 in the prior art adopts a quadrangular shape, and the mask can be spliced ​​into a square. The lighting system and mask of this structure are mainly used in the field of laser annealing, and cannot be used in the field of LED lithography.

[0005] At present, lithography machines for exposing patterned sapphire substrate patterns are affected by factors such as lens design cost or control system design. These machines have low yield and poor adaptability, and it is difficult to meet the needs of mass production.

Images