A kind of preparation method of halogen-free, high tg copper clad laminate

Abstract

The invention belongs to the technical field of copper-clad plate production and particularly relates to a preparation method of a halogen-free high Tg copper-clad plate. According to the invention, a polyfunctional group phosphorus epoxy resin is used as a matrix resin in combination with a phenol novolac epoxy used to improve the heat resistance of the plate and increase the glass-transition temperature of the plate, aluminum hydroxide used to improve the flame retardance of the plate, and talcum powder used to further improve the heat resistance of the plate. Surface treatment and particle size control are carried out to the aluminum hydroxide and talcum powder fillers, and the various materials are stirred and mixed by means of a high shear kettle disperser and an emulsifying motor, such that the fillers are uniformly dispersed into resin glue and glass fabric to improve the toughness of the plate. The total halogen content is less than 900 ppm, thus meeting the halogen-free requirement of European Union and the like. The produced copper-clad copper has high glass-transition temperature with a Tg value of greater than 160 DEG C in addition to basic properties such as electrical properties and insulation property of a conventional halogen-free copper-clad plate.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminate production, and in particular relates to a preparation method of a halogen-free, high-Tg copper-clad laminate. Background technique [0002] Substances including lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls and polybrominated diphenyl ethers are no longer allowed to be used in the manufacture of electronic products or their components; Greenpeace ( The greening policy vigorously promoted by GreenPeace at this stage requires all manufacturers to completely exclude brominated flame retardants and polyvinyl chloride from their electronic products, in order to comply with green electronics that are both lead-free and halogen-free. But at present, there are still many circuit board industries that use bromine-containing compounds, because brominated flame retardants have excellent flame retardant effects and low cost; when halides burn on fire, they will release a ...

AI Technical Summary

Problems solved by technology

But at present, there are still many circuit board industries that use bromine-containing compounds, because brominated flame retardants have excellent flame retardant effects and low cost; when halides burn on fire, they will release a large amount of highly toxic and corrosive hydrogen halides Gas, this gas not only pollutes the environment, but also causes certain damage to human health, and in the presence of bromine and chlorine, hydrocarbons will produce highly toxic substances such as dioxins during incomplete combustion at low temperatures

[0003] Conventional halogen-free Tg130 series (Tg130 means: the glass transition temperature of the plate is 130°C, hereinafter referred to as Tg130 plate) has a low glass transition temperature (125-145Tg150°C), resulting in poor heat resistance, which is 50S-80S ( According to IPC-TM-650-2.4.8 testing standard)

However, although the heat resistance of the phenolic resin-cured board can meet the requirements, the board is brittle and has poor toughness. When cutting, a large amount of powder is produced at the edge of the board, which easily pollutes the appearance of the board. Poor, not conducive to making high-precision end products

[0004] Therefore, in the field of copper clad laminate production, the market demand for high Tg halogen-free copper clad laminates is increasing, but high Tg type copper clad laminates still cannot well control the heat resistance, combustion and toughness requirements of the board.