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Room-temperature mold-curing heat-conducting wave-absorbing rubber material and preparation method thereof

A technology of molding and curing rubber materials, which is applied in the field of wave-absorbing rubber materials, can solve problems such as electromagnetic pollution, electromagnetic interference, and information leakage, and achieve low production costs and energy saving effects

Inactive Publication Date: 2017-05-31
DALIAN DONGSHIN MICROWAVE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the miniaturization and high integration of electronic components make the electromagnetic environment we live in more and more complex, causing electromagnetic interference, electromagnetic pollution and information leakage and other hazards.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] A room temperature molding and curing heat-conducting wave-absorbing rubber material, comprising the following substances in parts by weight:

[0051] α,ω-Dihydroxypolysiloxane: 100 parts;

[0052] Aluminum oxide: 50 parts;

[0053] Iron carbonyl: 50 parts;

[0054] Dibutyltin dilaurate: 2 parts;

[0055] Ethyl orthosilicate: 2 parts;

[0056] Methyl silicone oil: 10 parts.

[0057] The viscosity of the α,ω-dihydroxypolysiloxane is 5000mPa·s; the particle size of the alumina is 1 micron; the particle size of the carbonyl iron powder is 3 microns, and the viscosity of the methyl silicone oil is 500cps .

[0058] A method for preparing the above-mentioned room temperature molding and curing heat-conducting wave-absorbing rubber material has the following steps:

[0059] S1. Stir and mix the α,ω-dihydroxy polysiloxane, the aluminum oxide, the carbonyl iron and the methyl silicone oil according to the parts by weight;

[0060] S2. Add the dibutyltin dilaurate and the...

Embodiment 2

[0063] A room temperature molding and curing heat-conducting wave-absorbing rubber material, comprising the following substances in parts by weight:

[0064] α,ω-Dihydroxypolysiloxane: 100 parts;

[0065] Aluminum oxide: 50 parts;

[0066] Iron carbonyl: 50 parts;

[0067] Dibutyltin dilaurate: 2 parts;

[0068] Ethyl orthosilicate: 3 parts;

[0069] The viscosity of the α,ω-dihydroxypolysiloxane is 7000mPa·s; the particle size of the alumina is 3 microns;

[0070] A method for preparing the above-mentioned room temperature molding and curing heat-conducting wave-absorbing rubber material has the following steps:

[0071] S1. Stir and mix the α, ω-dihydroxy polysiloxane, the alumina, and the carbonyl iron according to the parts by weight;

[0072] S2. Add the dibutyltin dilaurate and the ethyl orthosilicate to the mixture obtained in step S1 according to the weight parts, and mix thoroughly;

[0073] S3, introducing the mixture obtained in step S2 into a mold for molding...

Embodiment 3

[0075]A room temperature molding and curing heat-conducting wave-absorbing rubber material, comprising the following substances in parts by weight:

[0076] α,ω-Dihydroxypolysiloxane: 100 parts;

[0077] Aluminum oxide: 50 parts;

[0078] Iron carbonyl: 100 parts;

[0079] Dibutyltin dilaurate: 3 parts;

[0080] Ethyl orthosilicate: 3 parts;

[0081] The viscosity of the α,ω-dihydroxy polysiloxane is 10000 mPa·s; the particle size of the aluminum oxide is 10 microns.

[0082] A method for preparing the above-mentioned room temperature molding and curing heat-conducting wave-absorbing rubber material has the following steps:

[0083] S1. Stir and mix the α, ω-dihydroxy polysiloxane, the alumina, and the carbonyl iron according to the parts by weight;

[0084] S2. Add the dibutyltin dilaurate and the ethyl orthosilicate to the mixture obtained in step S1 according to the weight parts, and mix thoroughly;

[0085] S3, introducing the mixture obtained in step S2 into a mold ...

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Abstract

The invention discloses a room-temperature mold-curing heat-conducting wave-absorbing rubber material and a preparation method thereof. The material comprises the following substances in parts by weight: 100 parts of rubber matrix, 50-400 parts of heat-conducting powder, 50-400 parts of wave-absorbing powder, 0.5-5 parts of catalyst, 1-10 parts of crosslinking agent and 0-60 parts of diluter. The room-temperature mold-curing heat-conducting wave-absorbing rubber material has the characteristics of high temperature resistance, low temperature resistance, radiation resistance and weather resistance, provides possibility for preparing the heat-conducting wave-absorbing material, has the advantages of low production cost and energy saving, can be directly used between a heat dissipation chamber and a metal shell, can effectively dissipate heat energies, has electromagnetic shielding and electromagnetic clutter absorbing properties, and thus, provides a favorable solution for electronic communication products in heat conduction and electromagnetic shielding.

Description

technical field [0001] The invention relates to a wave-absorbing rubber material, in particular to a room-temperature molding-cured heat-conducting wave-absorbing rubber material and a preparation method thereof. Background technique [0002] With the rapid development of information technology and the continuous improvement of electromagnetic theory, electromagnetic waves, as the carrier of information transmission, enrich all aspects of our production, life and society with its high speed and intelligence. However, the miniaturization and high integration of electronic components make the electromagnetic environment we live in more and more complex, causing electromagnetic interference, electromagnetic pollution and information leakage and other hazards. At the same time, heat dissipation is extremely important to electronic products. Statistics show that the reliability of electronic components decreases by 10% for every 2°C increase in temperature; the life at 50°C is on...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/06C08L83/04C08K13/04C08K13/02C08K3/22C08K3/18
CPCC08L83/06C08K3/18C08K3/22C08K13/02C08K2003/2227C08K2201/003C08K2201/014C08L2201/08C08L83/04
Inventor 来科
Owner DALIAN DONGSHIN MICROWAVE TECH
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