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Nanoscale electronic chip packaging material and preparation method

A technology for packaging materials and electronic chips, applied in nanotechnology, nanotechnology, nanotechnology for materials and surface science, etc., can solve the problems of variety and quality that cannot meet the needs of high-tech development, poor compatibility, etc.

Inactive Publication Date: 2017-05-31
SUZHOU XING CHUANG YUAN NEW MATERIALS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The variety and quality of high-temperature-resistant and high-performance packaging materials currently on the market are far from meeting the needs of the development of high-tech fields, and there are also problems such as poor compatibility in the preparation process.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Select hexamethyldisiloxane and vinyl-terminated polyethylene oxide, and obtain polyether-modified silane through hydrosilylation addition reaction under the action of manganese oxide catalyst; select hexamethyldisiloxane and epoxyhexylethylene, in Reaction under the action of manganese oxide catalyst to obtain epoxy silane; the above-mentioned synthetic polyether modified silane and epoxy silane are added with difunctional silane and monofunctional head capping agent, and co-hydrolyzed under the action of ammonia catalyst, Obtain epoxy-modified organosilicon prepolymer nanoparticles; select butenedioic anhydride and diethylenetriamine to mix according to the ratio of 4:3 to obtain a curing agent; the epoxy-modified organosilicon prepolymer nanoparticles obtained above , epoxy prepolymer, curing agent and accelerator are mixed according to the ratio of 8:3:1:1, and stirred evenly at 70°C for 3 hours to obtain the packaging material.

Embodiment 2

[0018] Select hexamethyldisiloxane and vinyl-terminated polyethylene oxide, and obtain polyether-modified silane through hydrosilylation addition reaction under the action of manganese oxide catalyst; select hexamethyldisiloxane and epoxyhexylethylene, in Reaction under the action of manganese oxide catalyst to obtain epoxy silane; the above-mentioned synthetic polyether modified silane and epoxy silane are added with difunctional silane and monofunctional head capping agent, and co-hydrolyzed under the action of ammonia catalyst, Obtain epoxy-modified organosilicon prepolymer nanoparticles; select butenedioic anhydride and diethylenetriamine to mix according to the ratio of 5:2 to obtain a curing agent; the epoxy-modified organosilicon prepolymer nanoparticles obtained above , epoxy prepolymer, curing agent and accelerator are mixed according to the ratio of 9:2:1:1, and stirred evenly at 70°C for 3 hours to obtain the packaging material.

Embodiment 3

[0020] Select hexamethyldisiloxane and vinyl-terminated polyethylene oxide, and obtain polyether-modified silane through hydrosilylation addition reaction under the action of manganese oxide catalyst; select hexamethyldisiloxane and epoxyhexylethylene, in Reaction under the action of manganese oxide catalyst to obtain epoxy silane; the above-mentioned synthetic polyether modified silane and epoxy silane are added with difunctional silane and monofunctional head capping agent, and co-hydrolyzed under the action of ammonia catalyst, Obtain epoxy-modified organosilicon prepolymer nanoparticles; select butenedioic anhydride and diethylenetriamine to mix according to the ratio of 6:5 to obtain a curing agent; the epoxy-modified organosilicon prepolymer nanoparticles obtained above , epoxy prepolymer, curing agent and accelerator are mixed according to the ratio of 10:3:2:0.5, and stirred evenly at 70°C for 3 hours to obtain the packaging material.

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PUM

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Abstract

The invention discloses a nanoscale electronic chip packaging material and a preparation method. The nanoscale electronic chip packaging material comprises 15-65% of an epoxy prepolymer, 30-70% of epoxy modified organosilicone prepolymer nanoparticles, 5-25% of a curing agent, 0-1% of an accelerant and 0-1% of other auxiliaries, wherein the curing agent includes amine terminal and hydroxyl POSS with a nanometer structure. Hydrogen-containing silane and terminal vinyl polyoxyethylene are selected and react with silane with two functional groups and an end enclosure agent with a single functional group under the effect of a Pt catalyst, cohydrolysis is performed under the effect of an ammonia catalyst, then the curing agent is added, and the mixture is uniformly stirred, so that the packaging material can be obtained. The product based on the technique can be adopted for avoiding the problem of poor compatibility of the other products in a preparation process, and meanwhile, the high temperature resistance of the product can be promoted.

Description

technical field [0001] The invention relates to a nanoscale electronic chip packaging material and a preparation method. Background technique [0002] With the development of high and new technologies such as aviation, aerospace, and electronics, the demand for high-performance packaging materials is increasing. Especially in special application environments, people have put forward higher requirements for the operability, machinability, and high and low temperature resistance of packaging materials. The variety and quality of high-temperature-resistant and high-performance packaging materials currently on the market are far from meeting the needs of the development of high-tech fields, and there are also problems such as poor compatibility in the preparation process. Contents of the invention [0003] The purpose of the present invention is to provide a nano-scale electronic chip packaging material and its preparation method, using nano-scale epoxy-modified silicone prep...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/12C08G59/42C08G59/50C08G59/68C08G77/46H01L23/29B82Y30/00
CPCB82Y30/00C08G59/4284C08G59/5006C08G59/68C08G59/687C08G77/46C08L83/12C08L2201/08C08L2203/206H01L23/296C08L63/00
Inventor 王行柱肖军吴卫平肖启振
Owner SUZHOU XING CHUANG YUAN NEW MATERIALS TECH CO LTD
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