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Aluminum heating element with aluminum nitride film, preparation method and heating device

A heating device, aluminum nitride technology, applied in the field of heaters, can solve the problems of reduced mechanical properties and thermal conductivity, inability to significantly improve heat dissipation efficiency, and limited improvement effect, so as to achieve improved heating effect, good thermal conductivity, and improved heat dissipation effect Effect

Inactive Publication Date: 2017-05-31
GD MIDEA ENVIRONMENT APPLIANCES MFG +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The counter balance heater adopts aluminum heating element, which is widely used because of its good thermal conductivity, simple production process and low price, but because its aluminum surface is easily oxidized to form alumina, and the thermal conductivity of alumina It is only 1 / 8 of aluminum, which greatly reduces its heat dissipation performance, thereby reducing its heating effect. In the existing production, its structure is optimized, such as made of string aluminum, fins and other structures to increase its heat dissipation area, thereby increasing Its heat dissipation effect can be replaced by other ceramic materials with excellent thermal conductivity, such as silicon carbide and other ceramic blocks
However, due to the limitation of structure and process, the heat dissipation area can only be increased limitedly, and its improvement effect is limited, and the heat dissipation efficiency cannot be significantly improved. However, the ceramic block heating element generally needs to be sintered, and its sintering temperature needs to be 1000°- 1900°, the process is not easy to control, and defects such as holes are prone to occur, resulting in reduced mechanical properties and thermal conductivity, and the use of bulk ceramic materials has a large volume, high material consumption, and high production costs

Method used

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  • Aluminum heating element with aluminum nitride film, preparation method and heating device

Examples

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Effect test

Embodiment 1

[0026] This embodiment provides an aluminum heating element with an aluminum nitride film, the structure of which is as follows figure 1 Shown; includes an aluminum substrate 1, the surface of which is covered with an aluminum nitride film 2.

[0027] The thickness of the aluminum nitride film can be set in different specifications according to actual needs, such as 1 μm, 10 μm, 100 μm or 300 μm.

[0028] The density of the aluminum nitride film is at 2.85g / cm 3 ~3.02g / cm 3 range, so as to ensure that the aluminum nitride film can achieve sufficient heat conduction effect.

[0029] In the present invention, the aluminum nitride film is covered on the surface of the aluminum heating element to isolate the contact between the aluminum and the air, thereby preventing the aluminum surface from being oxidized into alumina. After the aluminum substrate is heated, the heat is transferred to the aluminum nitride on the aluminum surface. Aluminum has good thermal conductivity, and c...

Embodiment 2

[0031] Compared with Example 1, the only difference is that a heating wire is arranged inside the aluminum base.

[0032] After heating, the heating wire inside the heating element provided in this embodiment transmits the heat to the aluminum substrate, and then transmits the heat to the aluminum nitride film, so that the heat can be quickly and efficiently transmitted to the environment.

Embodiment 3

[0034] This embodiment provides a method for preparing an aluminum heating element with an aluminum nitride film, comprising the following steps: connecting one pole of the pulse power supply to the aluminum substrate, and connecting the other pole of the pulse power supply to an aluminum tool electrode ; Start the pulse power supply, and move the tool electrode above the aluminum substrate in a nitrogen atmosphere, thereby forming an aluminum nitride film on the surface of the aluminum substrate.

[0035] During the preparation process, the distance between the tool electrode and the aluminum substrate was 0.2mm; the voltage of the pulse power supply was 450V, and the current was 11A; the pulse width of the pulse power supply was 100μs, and the pulse interval was 275μs.

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Abstract

The invention relates to an aluminum heating element with an aluminum nitride film. The aluminum heating element comprises an aluminum substrate, wherein the aluminum nitride film covers the surface of the aluminum substrate. The invention further relates to a preparation method of the aluminum heating element with the aluminum nitride film. According to the method, one electrode of a pulsed power supply is connected with the aluminum substrate, and the other electrode is connected with an aluminum tool electrode; the pulsed power supply is started, and the tool electrode is moved above the aluminum substrate in a nitrogen atmosphere, so that the aluminum nitride film is formed on the surface of the aluminum substrate. According to the heating element provided by the invention, the aluminum nitride film is formed on the surface of the aluminum substrate, so that aluminum is prevented from being oxidized into aluminum oxide, the heat conducting property of the formed aluminum heating element cannot be reduced due to the aluminum oxide formed on the surface, and fast heat transfer can be realized, thereby improving the heat transfer efficiency; the production process of the heating element provided by the invention has the advantages of simplicity and low cost. The heating element provided by the invention can be applied to a heating device and has great market application values especially on a balance type heater.

Description

technical field [0001] The invention relates to the field of heaters, in particular to an aluminum heating element with an aluminum nitride film. Background technique [0002] The counter balance heater adopts aluminum heating element, which is widely used because of its good thermal conductivity, simple production process and low price, but because its aluminum surface is easily oxidized to form alumina, and the thermal conductivity of alumina It is only 1 / 8 of aluminum, which greatly reduces its heat dissipation performance, thereby reducing its heating effect. In the existing production, its structure is optimized, such as made of string aluminum, fins and other structures to increase its heat dissipation area, thereby increasing The heat dissipation effect may be replaced by other ceramic materials with excellent thermal conductivity, such as ceramic blocks such as silicon carbide. However, due to the limitation of structure and process, the heat dissipation area can on...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C8/24F24D13/02H05B3/10
CPCC23C8/24F24D13/02H05B3/10H05B2203/017
Inventor 杨鑫杜文波刘云艳
Owner GD MIDEA ENVIRONMENT APPLIANCES MFG
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