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Electroplate liquid of non-cyanide hard gold plating and electroplating method thereof

An electroplating solution and hard gold plating technology, which is applied in the field of cyanide-free hard gold plating electroplating solution, can solve the problems of easy oxidation of sulfite and unstable plating solution, so as to expand the range of working current density and improve the speed of electrodeposition. , The effect of less stress on the coating

Inactive Publication Date: 2017-05-31
HUIZHOU LEADAO ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, sulfite gold plating is the most researched and widely used, but sulfite is easily oxidized, resulting in unstable plating solution.

Method used

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  • Electroplate liquid of non-cyanide hard gold plating and electroplating method thereof
  • Electroplate liquid of non-cyanide hard gold plating and electroplating method thereof
  • Electroplate liquid of non-cyanide hard gold plating and electroplating method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A cyanide-free electroplating solution for hard gold plating, comprising a mass concentration of 200ppm organic additives, 15g / L carbene gold sulfonate, 130g / L ammonium citrate, 18g / L dipotassium hydrogen phosphate, 35g / L hydroxyethylene di Phosphonic acid.

[0027] Further, the organic additive is polyethyleneimine.

[0028] Further, the pH value of the electroplating solution is controlled at 7.

[0029] Further, the chemical structural formula of the gold sulfonate carbene is .

[0030] A kind of electroplating method of the electroplating solution of cyanide-free hard gold plating, comprises the following steps:

[0031] S1. Prepare the above-mentioned electroplating solution, and adjust the temperature of the electroplating solution to be 55° C.;

[0032] S2. Use the gold plate as the anode and the piece to be plated as the cathode, apply a single pulse power supply between the anode and the cathode, the pulse width of the single pulse power supply is 120ms, t...

Embodiment 2

[0036] A cyanide-free electroplating solution for hard gold plating, comprising a mass concentration of 250ppm organic additive, 22g / L carbene gold sulfonate, 110g / L ammonium citrate, 125g / L dipotassium hydrogen phosphate, 35g / L hydroxyethylene di Phosphonic acid.

[0037] Further, the organic additive is bipyridine.

[0038] Further, the pH value of the electroplating solution is controlled at 7.

[0039] Further, the chemical structural formula of the gold sulfonate carbene is .

[0040] A kind of electroplating method of the electroplating solution of cyanide-free hard gold plating, comprises the following steps:

[0041] S1. Prepare the above-mentioned electroplating solution, and adjust the temperature of the electroplating solution to be 45° C.;

[0042] S2. Use the gold plate as the anode and the piece to be plated as the cathode, apply a single pulse power supply between the anode and the cathode, the pulse width of the single pulse power supply is 110ms, the duty...

Embodiment 3

[0046] A cyanide-free electroplating solution for hard gold plating, comprising a mass concentration of 220ppm organic additives, 18g / L carbene gold sulfonate, 120g / L ammonium citrate, 22g / L dipotassium hydrogen phosphate, 30g / L hydroxyethylene di Phosphonic acid.

[0047] Further, the organic additive is a mixture of polyethyleneimine and bipyridine, and the mass fraction ratio thereof is 1:1.

[0048] Further, the pH value of the electroplating solution is controlled at 7.

[0049] Further, the chemical structural formula of the gold sulfonate carbene is .

[0050] A kind of electroplating method of the electroplating solution of cyanide-free hard gold plating, comprises the following steps:

[0051] S1. Prepare the above-mentioned electroplating solution, and adjust the temperature of the electroplating solution to be 65° C.;

[0052] S2. Use the gold plate as the anode and the piece to be plated as the cathode, apply a single pulse power supply between the anode and t...

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Abstract

The invention provides electroplate liquid of non-cyanide hard gold plating and an electroplating method thereof. The sulfonate carbine gold is used as hard gold plating main salt, an organic additive is used as a complexing agent, and other additive components are used for compounding and synergizing; a non-cyanide hard gold plating solution is free from containing the cyanide, non-toxic to the environment and the human body, reasonable in formula, and good in solution stability; the effective control on the electroplating gold crystal (200) can be realized by adding the organic additive and adjusting the concentration; the acquired hard gold plating layer can be used for the preparation of a gold plating layer of a golden finger of a hot plug, and the abrasive resistance and the reliability of the golden finger can be improved at the same time; The electroplate liquid can be used for the processing of the gold plating layer on the golden finger surface of the hot plug.

Description

technical field [0001] The invention belongs to the technical field of cyanide-free electroplating, and in particular relates to a cyanide-free electroplating solution for hard gold plating and an electroplating method thereof. Background technique [0002] Hard gold is mainly used in the "gold finger" processing of hot-swappable parts, and is mainly used on the surface of hot-swappable gold-plated layers such as memory, earphones, and flash drives. The purpose of electroplating hard gold is to increase the hardness of gold plating and improve the friction resistance of the gold layer. Through research, it is found that the main crystal plane index of hard gold is (200) crystal plane. At present, the earliest and most widely used electroplating technology is cyanide electroplating. The cyanide gold plating solution is mainly composed of gold cyanide complex salt and free cyanide. The plating solution has good dispersion and coverage capabilities, high current efficiency, g...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/48C25D5/18
Inventor 黄兴桥崔皓博
Owner HUIZHOU LEADAO ELECTRONICS MATERIAL