Electroplate liquid of non-cyanide hard gold plating and electroplating method thereof
An electroplating solution and hard gold plating technology, which is applied in the field of cyanide-free hard gold plating electroplating solution, can solve the problems of easy oxidation of sulfite and unstable plating solution, so as to expand the range of working current density and improve the speed of electrodeposition. , The effect of less stress on the coating
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0026] A cyanide-free electroplating solution for hard gold plating, comprising a mass concentration of 200ppm organic additives, 15g / L carbene gold sulfonate, 130g / L ammonium citrate, 18g / L dipotassium hydrogen phosphate, 35g / L hydroxyethylene di Phosphonic acid.
[0027] Further, the organic additive is polyethyleneimine.
[0028] Further, the pH value of the electroplating solution is controlled at 7.
[0029] Further, the chemical structural formula of the gold sulfonate carbene is .
[0030] A kind of electroplating method of the electroplating solution of cyanide-free hard gold plating, comprises the following steps:
[0031] S1. Prepare the above-mentioned electroplating solution, and adjust the temperature of the electroplating solution to be 55° C.;
[0032] S2. Use the gold plate as the anode and the piece to be plated as the cathode, apply a single pulse power supply between the anode and the cathode, the pulse width of the single pulse power supply is 120ms, t...
Embodiment 2
[0036] A cyanide-free electroplating solution for hard gold plating, comprising a mass concentration of 250ppm organic additive, 22g / L carbene gold sulfonate, 110g / L ammonium citrate, 125g / L dipotassium hydrogen phosphate, 35g / L hydroxyethylene di Phosphonic acid.
[0037] Further, the organic additive is bipyridine.
[0038] Further, the pH value of the electroplating solution is controlled at 7.
[0039] Further, the chemical structural formula of the gold sulfonate carbene is .
[0040] A kind of electroplating method of the electroplating solution of cyanide-free hard gold plating, comprises the following steps:
[0041] S1. Prepare the above-mentioned electroplating solution, and adjust the temperature of the electroplating solution to be 45° C.;
[0042] S2. Use the gold plate as the anode and the piece to be plated as the cathode, apply a single pulse power supply between the anode and the cathode, the pulse width of the single pulse power supply is 110ms, the duty...
Embodiment 3
[0046] A cyanide-free electroplating solution for hard gold plating, comprising a mass concentration of 220ppm organic additives, 18g / L carbene gold sulfonate, 120g / L ammonium citrate, 22g / L dipotassium hydrogen phosphate, 30g / L hydroxyethylene di Phosphonic acid.
[0047] Further, the organic additive is a mixture of polyethyleneimine and bipyridine, and the mass fraction ratio thereof is 1:1.
[0048] Further, the pH value of the electroplating solution is controlled at 7.
[0049] Further, the chemical structural formula of the gold sulfonate carbene is .
[0050] A kind of electroplating method of the electroplating solution of cyanide-free hard gold plating, comprises the following steps:
[0051] S1. Prepare the above-mentioned electroplating solution, and adjust the temperature of the electroplating solution to be 65° C.;
[0052] S2. Use the gold plate as the anode and the piece to be plated as the cathode, apply a single pulse power supply between the anode and t...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 


