Photolithography solution prediction method based on layout geometric feature matching
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- INST OF MICROELECTRONICS CHINESE ACAD OF SCI
- Publication Date
- 2017-05-31
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Abstract
Description
technical field
[0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a lithography solution prediction method based on layout geometric feature matching. Background technique
[0002] With the improvement of semiconductor technology level and the growth of market demand, the complexity of very large scale integration (VLSI) design is getting higher and higher, and there are some unexpected adverse interactions between design layout and production process flow. Process imperfections lead to highly variable layout geometry feature sizes, making these interactions very difficult to predict. Ideally, a physical design layout verification step should be able to capture potential process defect-prone geometries in the layout.
[0003] The function of traditional design rule checking (DRC) is based on a large number of pre-set fixed geometric size combination rules. By checking whether the graphic structure meets the requirements of ...