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Packaging method for quantum dot LED bead

A technology of LED lamp beads and packaging method, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of difficulty in large-scale industrialization, low light conversion efficiency, complex process, etc., to reduce difficulty and product defect rate, High excitation efficiency and improved color gamut value

Active Publication Date: 2017-05-31
HUIZHOU JUFEI OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For this reason, the technical problem to be solved by the present invention is to overcome the technical bottleneck of the prior art which is complicated in technology, low in light conversion efficiency, high in cost, and difficult to realize large-scale industrialization, thereby proposing a kind of high color gamut value, avoiding the quantum dot Encapsulation method of fluorescent powder affected by external moisture and oxygen, high yield, and mass-produced quantum dot LED beads

Method used

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  • Packaging method for quantum dot LED bead
  • Packaging method for quantum dot LED bead
  • Packaging method for quantum dot LED bead

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] 1) Weigh 0.05g of AgInS with an emission wavelength of 655nm 2 For red light quantum dot phosphor powder, weigh 1.21g of silicate green light phosphor powder with an emission wavelength of 535nm, and put them together in a container.

[0032] 2) Weigh 10.55g of epoxy-based packaging glue, pour it into the two light-emitting materials weighed in step 1), and carry out vacuum defoaming and stirring to obtain quantum dot fluorescent glue.

[0033] 3) Take the quantum dot fluorescent glue obtained in step 2) and drop it into the LED bracket that has been fixed with a blue light chip (the emission wavelength of the chip is 465nm), and control the volume of the dropped quantum dot fluorescent glue to account for 80% of the internal volume of the bracket cup shell .

[0034] 4) Place the LED bracket dripped with quantum dot fluorescent glue obtained in step 3) in an oven, and bake at 50° C. for 8 hours to cure the quantum dot fluorescent glue.

[0035] 5) Take a certain amou...

Embodiment 2

[0038] 1) Weigh 0.13g of MgTe, CsPbBr whose emission wavelength is 638nm 3 For the red light quantum dot phosphor powder, weigh 0.08g of CdTe and ZnS green light quantum dot phosphor powder with an emission wavelength of 544nm, and place them together in a container.

[0039] 2) Weigh 1.55g of polyurethane-based encapsulating glue, pour it into the two light-emitting materials weighed in step 1), and carry out vacuum defoaming and stirring to obtain quantum dot fluorescent glue.

[0040] 3) Take the quantum dot fluorescent glue obtained in step 2) and drop it into the LED bracket that has been fixed with a blue light chip (the emission wavelength of the chip is 450nm), and control the volume of the dropped quantum dot fluorescent glue to account for 5% of the internal volume of the bracket cup shell .

[0041] 4) Place the LED bracket dripped with quantum dot fluorescent glue obtained in step 3) in an oven, and bake at 160°C for 0.5h to cure the quantum dot fluorescent glue. ...

Embodiment 3

[0045]1) Weigh 0.75g of aluminate red phosphor with emission wavelength of 635nm, 0.04g of GaS green quantum dot phosphor with emission wavelength of 532nm, and 0.25g of phosphate blue phosphor with emission wavelength of 470nm , placed together in the container.

[0046] 2) Weigh 2.32g of epoxy packaging glue, pour it into the two kinds of luminescent materials weighed in step 1), carry out vacuum defoaming and stirring, and obtain quantum dot fluorescent glue.

[0047] 3) Take the quantum dot fluorescent glue obtained in step 2) and drop it into the LED bracket that has been fixed with an ultraviolet chip (the emission wavelength of the chip is 320nm), and control the volume of the dropped quantum dot fluorescent glue to account for 35% of the internal volume of the bracket cup shell. %.

[0048] 4) Place the LED bracket dripped with quantum dot fluorescent glue obtained in step 3) in an oven, and bake at 150° C. for 2 hours to cure the quantum dot fluorescent glue.

[004...

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Abstract

The invention belongs to the field of LED backlight processing, and particularly relates to a packaging method for a quantum dot LED bead. The method has the advantages that a prepared quantum dot material achieves a smaller half-wave width, so that the color gamut of the LED bead can be greatly improved (the color gamut of the obtained LED bead can exceed NTSC 95%); secondary glue dispensing is adopted, that is, a layer of packaging glue is additionally arranged on quantum dot fluorescent powders, so that corrosion of moisture and oxygen to the quantum dot material in the LED bead is reduced, and the bead is more reliable; the white LED bead is obtained through the quantum dot fluorescent powders, and the concentration of the quantum dot fluorescent powders is low during packaging because of a high excitation efficiency of the quantum dot fluorescent powders, so that packaging difficulties and the product rejection ratio are reduced, and the applicability for mass industrial production is achieved; and enormous market prospects and economic value are achieved.

Description

technical field [0001] The invention belongs to the field of LED backlight processing, and in particular relates to a packaging method for quantum dot LED lamp beads. Background technique [0002] Since the beginning of the 21st century, backlight technology has developed rapidly, and new technologies and products have been launched continuously. LED backlight has become the mainstream of the market. Compared with the traditional CCFL backlight, LED backlight has many advantages such as high color gamut, high brightness, long life, energy saving and environmental protection, real-time color controllable, etc., especially the high color gamut LED backlight makes TV, mobile phone, The screens of electronic products such as tablets have more vivid colors and a higher degree of color reproduction. At present, the commonly used LED backlight adopts the form of blue light chip to excite YAG yellow light phosphor. Due to the lack of red light component in the backlight, the color ...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L33/48H01L33/50H01L33/52H01L33/56
CPCH01L33/005H01L33/48H01L33/502H01L33/52H01L33/56H01L2933/0008H01L2933/0041H01L2933/005
Inventor 高丹鹏张志宽邢其彬邓炼健王旭改
Owner HUIZHOU JUFEI OPTOELECTRONICS CO LTD
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