Packaging method for quantum dot LED bead

A technology of LED lamp beads and packaging method, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of difficulty in large-scale industrialization, low light conversion efficiency, complex process, etc., to reduce difficulty and product defect rate, High excitation efficiency and improved color gamut value

Active Publication Date: 2017-05-31
HUIZHOU JUFEI OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] For this reason, the technical problem to be solved by the present invention is to overcome the technical bottleneck of the prior art which is complicated in technology, low in light conversion efficiency, high in cost, and difficult to real

Method used

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  • Packaging method for quantum dot LED bead
  • Packaging method for quantum dot LED bead
  • Packaging method for quantum dot LED bead

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0030] Example 1:

[0031] 1) Weigh out 0.05g AgInS whose emission wavelength is 655nm 2 Red light quantum dot fluorescent powder, weigh 1.21g of silicate green light fluorescent powder with emission wavelength of 535nm, and put them together in a container.

[0032] 2) Weigh 10.55 g of epoxy encapsulating glue, pour it into the two luminescent materials weighed in step 1), and perform vacuum degassing and stirring to obtain quantum dot fluorescent glue.

[0033] 3) Take the quantum dot fluorescent glue obtained in step 2) and drop it into the LED holder with the blue chip (the emission wavelength of the chip is 465nm), and control the dropped quantum dot fluorescent glue to account for 80% of the inner volume of the holder cup .

[0034] 4) Place the LED stent with quantum dot fluorescent glue dripped from step 3) in an oven and bake at 50° C. for 8 hours to cure the quantum dot fluorescent glue.

[0035] 5) Take a certain amount of silicone encapsulation glue and drop it into the LED...

Example Embodiment

[0037] Example 2:

[0038] 1) Weigh out 0.13g of MgTe and CsPbBr with emission wavelength of 638nm 3 Red light quantum dot phosphors, weighed 0.08g of CdTe, ZnS green light quantum dot phosphors with emission wavelength of 544nm, and put them together in a container.

[0039] 2) Weigh 1.55 g of polyurethane packaging glue, pour it into the two luminescent materials weighed in step 1), and perform vacuum degassing and stirring to obtain quantum dot fluorescent glue.

[0040] 3) Take the quantum dot fluorescent glue obtained in step 2) and drop it into the LED holder with the blue chip (the emission wavelength of the chip is 450nm), and the volume of the quantum dot fluorescent glue dropped into the holder is 5% of the inner volume of the holder. .

[0041] 4) Place the LED stent with quantum dot fluorescent glue dripped from step 3) in an oven and bake at 160° C. for 0.5 h to cure the quantum dot fluorescent glue.

[0042] 5) Take a certain amount of silicone encapsulation glue and drop...

Example Embodiment

[0044] Example 3:

[0045] 1) Weigh 0.75g of aluminate red phosphor with emission wavelength of 635nm, 0.04g of GaS green quantum dot phosphor with emission wavelength of 532nm, and 0.25g of phosphate blue phosphor with emission wavelength of 470nm , Put together in the container.

[0046] 2) Weigh 2.32 g of epoxy encapsulation glue, pour it into the two luminescent materials weighed in step 1), and perform vacuum degassing and stirring to obtain quantum dot fluorescent glue.

[0047] 3) Take the quantum dot fluorescent glue obtained in step 2) and drop it into the LED holder with the UV chip (the emission wavelength of the chip is 320nm), and control the volume of the dropped quantum dot fluorescent glue to account for 35 percent of the internal volume of the holder cup. %.

[0048] 4) Place the LED stent with quantum dot fluorescent glue dripped from step 3) in an oven and bake at 150° C. for 2 hours to cure the quantum dot fluorescent glue.

[0049] 5) Take a certain amount of poly...

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Abstract

The invention belongs to the field of LED backlight processing, and particularly relates to a packaging method for a quantum dot LED bead. The method has the advantages that a prepared quantum dot material achieves a smaller half-wave width, so that the color gamut of the LED bead can be greatly improved (the color gamut of the obtained LED bead can exceed NTSC 95%); secondary glue dispensing is adopted, that is, a layer of packaging glue is additionally arranged on quantum dot fluorescent powders, so that corrosion of moisture and oxygen to the quantum dot material in the LED bead is reduced, and the bead is more reliable; the white LED bead is obtained through the quantum dot fluorescent powders, and the concentration of the quantum dot fluorescent powders is low during packaging because of a high excitation efficiency of the quantum dot fluorescent powders, so that packaging difficulties and the product rejection ratio are reduced, and the applicability for mass industrial production is achieved; and enormous market prospects and economic value are achieved.

Description

technical field [0001] The invention belongs to the field of LED backlight processing, and in particular relates to a packaging method for quantum dot LED lamp beads. Background technique [0002] Since the beginning of the 21st century, backlight technology has developed rapidly, and new technologies and products have been launched continuously. LED backlight has become the mainstream of the market. Compared with the traditional CCFL backlight, LED backlight has many advantages such as high color gamut, high brightness, long life, energy saving and environmental protection, real-time color controllable, etc., especially the high color gamut LED backlight makes TV, mobile phone, The screens of electronic products such as tablets have more vivid colors and a higher degree of color reproduction. At present, the commonly used LED backlight adopts the form of blue light chip to excite YAG yellow light phosphor. Due to the lack of red light component in the backlight, the color ...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L33/48H01L33/50H01L33/52H01L33/56
CPCH01L33/005H01L33/48H01L33/502H01L33/52H01L33/56H01L2933/0008H01L2933/0041H01L2933/005
Inventor 高丹鹏张志宽邢其彬邓炼健王旭改
Owner HUIZHOU JUFEI OPTOELECTRONICS CO LTD
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