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Method for packaging layered quantum dot LED lamp beads

A technology of LED lamp beads and packaging method, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of difficulty in large-scale industrialization, low light conversion efficiency, complex process, etc., to reduce difficulty and product defect rate, The effect of low phosphor concentration and high excitation efficiency

Inactive Publication Date: 2017-04-05
HUIZHOU JUFEI OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For this reason, the technical problem to be solved by the present invention is to overcome the technical bottleneck of the prior art which is complicated in technology, low in light conversion efficiency, high in cost, and difficult to realize large-scale industrialization, thereby proposing a kind of high color gamut value, avoiding the quantum dot A packaging method for layered quantum dot LED lamp beads that is affected by external moisture, oxygen and high temperature of the chip, has a high yield rate, and can be mass-produced industrially.

Method used

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  • Method for packaging layered quantum dot LED lamp beads
  • Method for packaging layered quantum dot LED lamp beads
  • Method for packaging layered quantum dot LED lamp beads

Examples

Experimental program
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Embodiment 1

[0035] Embodiment 1: This embodiment discloses a

[0036] 1) Weigh 0.75g of fluoride red phosphor powder with an emission wavelength of 638nm and place it in container A.

[0037] 2) Weigh 2.35g of epoxy-based packaging glue A, pour it into the fluoride red fluorescent powder weighed in step 1), and carry out vacuum defoaming and stirring to obtain fluorescent glue A.

[0038] 3) Take a certain amount of the fluorescent glue A obtained in step 2) and drop it into the LED bracket that has been fixed with a blue light chip (the emission wavelength of the chip is 450nm), and control the volume of the dropped fluorescent glue A to account for 35% of the internal volume of the bracket cup. %.

[0039] 4) Put the LED bracket obtained in step 3) in an oven and bake at 100° C. for 4 hours to cure the luminescent material A fluorescent glue.

[0040] 5) Weigh again 0.08g of PbZrO with an emission wavelength of 544nm 3 , Fe 2 o 3 The green light quantum dot phosphor powder is place...

Embodiment 2

[0045] 1) Weigh 0.13g of CdSe red light quantum dot phosphor powder with an emission wavelength of 635nm, and 0.09g of MgTe and NaCl blue light quantum dot phosphor powder with an emission wavelength of 458nm, and place them in container A.

[0046] 2) Weigh 5.03g of epoxy-based packaging glue A, pour it into the quantum dot fluorescent powder weighed in step 1), and carry out vacuum defoaming and stirring to obtain quantum dot fluorescent glue A.

[0047] 3) Take a certain amount of quantum dot fluorescent glue A obtained in step 2) and drop it into the LED bracket that has been fixed with a UV chip (the chip emits light at a wavelength of 230nm), and control the volume of the dropped fluorescent glue A to occupy the inside of the bracket cup shell 55% of volume.

[0048] 4) Put the LED bracket obtained in step 3) in an oven and bake at 150°C for 1 hour to cure the quantum dot fluorescent glue A.

[0049] 5) Weigh again 0.55g of silicate green fluorescent powder with an emis...

Embodiment 3

[0054] 1) Weigh 0.07g of GaS red light quantum dot phosphor powder with an emission wavelength of 655nm, and place it in container A.

[0055] 2) Weigh 0.72g of silica gel-based packaging glue A, pour it into the GaS red light quantum dot phosphor powder weighed in step 1), and carry out vacuum defoaming and stirring to obtain quantum dot fluorescent glue A.

[0056] 3) Take a certain amount of quantum dot fluorescent glue A obtained in step 2) and drop it into the LED bracket that has been fixed with a blue light chip (the chip emits light at a wavelength of 430nm), and control the volume of the dropped fluorescent glue A to account for the internal volume of the bracket cup shell 5%.

[0057] 4) Put the LED bracket obtained in step 3) in an oven and bake at 50°C for 8 hours to cure the quantum dot fluorescent glue A.

[0058] 5) Weigh again 0.53g of phosphate green dot fluorescent powder with an emission wavelength of 535nm, and place it in container B.

[0059] 6) Weigh 2...

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Abstract

The invention belongs to the field of LED backlight processing, and more particularly to a method for packaging layered quantum dot LED lamp beads. The half-wave width of a quantum dot material used in the method is narrow, and the color gamut value of the LED lamp bead can be greatly increased to be more than NTSC 94%. The quantum dot fluorescent powders and other luminescent materials are injected into the LED step by step to form a layered structure. The method can avoid a case that a variety of luminescent materials react to each other in a later lamp bead lighting process and thus results in damage to the structure of quantum fluorescent powders and light attenuation. The method can improve the reliability of LED lamp beads. Since the quantum dot fluorescent powders of a white LED lamp bead prepared from the quantum dot fluorescent powders have high excitation efficiency and have low concentration in a packaging process, packaging difficulty and product reject ratio are reduced so that the method is suitable for large-scale industrial production and has great market prospects and economic value.

Description

technical field [0001] The invention belongs to the field of LED backlight processing, and in particular relates to a packaging method for layered quantum dot LED lamp beads. Background technique [0002] Since the beginning of the 21st century, backlight technology has developed rapidly, and new technologies and products have been launched continuously. LED backlight has become the mainstream of the market. Compared with the traditional CCFL backlight, LED backlight has many advantages such as high color gamut, high brightness, long life, energy saving and environmental protection, real-time color controllable, etc., especially the high color gamut LED backlight makes TV, mobile phone, The screens of electronic products such as tablets have more vivid colors and a higher degree of color reproduction. At present, the commonly used LED backlight adopts the form of blue light chip to excite YAG yellow light phosphor. Due to the lack of red light component in the backlight, th...

Claims

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Application Information

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IPC IPC(8): H01L33/50H01L33/56
CPCH01L33/504H01L33/505H01L33/507H01L33/56H01L2933/0041H01L2933/005
Inventor 高丹鹏张志宽邢其彬龚涛王旭改
Owner HUIZHOU JUFEI OPTOELECTRONICS CO LTD
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