Graphene bonded copper wire and preparation method thereof

A technology of bonding copper wire and graphene, which is applied in the manufacture of semiconductor/solid-state devices, electrical components, electric solid-state devices, etc., can solve the problems of easy oxidation and hardness of copper wires, and achieve easy oxidation, increase conductivity and heat dissipation Effect

Inactive Publication Date: 2017-06-09
SHANDONG KEDADINGXIN ELECTRONICS TECH
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Problems solved by technology

[0003] The invention provides a graphene-bonded copper wire and a preparation method thereof. The method is simple to operate, solves the problem that the copper wire is easily oxidized without increasing the hardness of the material, and increases the conductivity and heat dissipation of the material

Method used

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  • Graphene bonded copper wire and preparation method thereof

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Embodiment Construction

[0019] In order to better understand the above-mentioned technical solution, the above-mentioned technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0020] Such as figure 1 As shown, a graphene-bonded copper wire includes a copper wire 1 and a graphene layer 2 wrapped outside the copper wire 1, the wire diameter of the copper wire 1 is 0.016-0.050mm, and the thickness of the graphene layer 2 is 0.001-0.2um.

[0021] A kind of preparation method of graphene bonding copper wire of the present invention, comprises the following steps:

[0022] S1. Oxidize the graphite flakes to form a graphene oxide aqueous solution;

[0023] S2, coating the graphene oxide solution on the surface of the bonding copper wire;

[0024] S3, reducing the graphene oxide to graphene, and directly covering the surface of the bonding copper wire;

[0025] S4. Coating an annealing solution on the surface of the graphe...

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Abstract

The invention provides a graphene bonded copper wire and a preparation method thereof. The graphene bonded copper wire comprises a copper wire and a graphene layer which packages the copper wire. The diameter of the copper wire is 0.016-0.050mm. The thickness of the graphene layer is 0.001-0.2 [mu]m. The preparation method comprises the following steps of S1, oxidizing crystalline flake graphite and preparing graphene oxide aqueous solution; S2, applying the graphene oxide aqueous solution on the surface of a bonding copper wire; S3, restoring the graphene oxide for obtaining the graphene, and directly packaging the bonding copper wire; and S4, applying annealing solution on the surface of the graphene bonded copper wire and performing drying. The graphene bonded copper wire and the preparation method thereof settle problems of easy copper wire oxidation and adhesion of external packaging wires. Furthermore the graphene bonded copper wire and the preparation method further have advantages of realizing environment-friendly performance, improving conductivity and heat radiation performance of the material. The graphene bonded copper wire and the preparation method improve an industrialization process of the copper base bonded wire.

Description

technical field [0001] The invention relates to the field of manufacturing bonding wires for microelectronic packaging, in particular to a graphene bonding copper wire and a preparation method thereof. Background technique [0002] Copper as a bonding wire material has the characteristics of good electrical conductivity and thermal conductivity, but the disadvantage of easy oxidation of copper wires has always restricted the large-scale application of bonding copper wires in the field of semiconductor packaging, especially high-end packaging forms have not been applied. The general method currently used is to coat the surface of the copper wire with a layer of precious metal palladium gold to play an anti-oxidation effect, but the production cost is greatly increased, and the hardness of the material is significantly increased, which is not conducive to bonding. Contents of the invention [0003] The invention provides a graphene-bonded copper wire and a preparation method...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49H01L21/48
CPCH01L24/43H01L24/45H01L2224/45147H01L2224/43H01L2224/45693H01L2924/01029H01L2924/01006H01L2224/45015H01L2224/45565H01L2224/43848H01L2924/00014H01L2924/20751H01L2924/20752H01L2924/20753H01L2924/20754H01L2924/20755
Inventor 李天祥孔杰
Owner SHANDONG KEDADINGXIN ELECTRONICS TECH
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