Unit type independent control box body structure

Abstract

The invention provides a unit type independent control box body structure. An integral type storage cabinet is divided into a plurality of independent chambers. Each chamber communicates with a vacuum pump for vacuuming and a vacuum breaking gas source for breaking vacuum, and an intelligent control system is adopted to realize intelligent control over the process of vacuuming and breaking the vacuum, so that the function of vacuum intelligent wafer storage is achieved. Compared with the traditional nitrogen cabinet, the whole process of wafer storage in the unit type independent control box body structure is in a vacuum state, the oxygen content of 10 ppm can be ensured, the oxidation problem of wafers in the storage process is eliminated completely, and nitrogen is not needed in the wafer storage process, the cost is greatly reduced, accessing operation of each chamber does not affect the other chambers, and the operating cost is reduced; in addition, the control system is more intelligent , the storage historical status can be inquired, and the current or historically stored wafer batch number and the storage time of each chamber can be automatically saved to facilitate the follow-up traceability. A man-machine operation interface adopts a touch screen and a scanning gun, and is easy to operate.

Description

technical field [0001] The invention relates to a storage device for wafers, in particular to a unit type independent control box structure. Background technique [0002] As the manufacturing wire diameter of the semiconductor industry becomes smaller and smaller, pollution prevention and control gradually shifts from dust particles to gaseous molecular pollutants. High-quality silicon device processes are critical. If the surface quality of the wafer cannot meet the requirements, no matter how well other process steps are controlled, it is impossible to obtain high-quality semiconductor devices. Wafers in existing semiconductor manufacturing companies are usually stored in nitrogen cabinets or oxygen-free nitrogen cabinets, and the minimum oxygen content can only reach about 1%, resulting in the risk of wafer oxidation during storage; and the existing nitrogen cabinets need to be replenished all the time Nitrogen, high operating costs. In addition, the structure of the n...

AI Technical Summary

Problems solved by technology

Wafers in existing semiconductor manufacturing companies are usually stored in nitrogen cabinets or oxygen-free nitrogen cabinets, and the minimum oxygen content can only reach about 1%, resulting in the risk of wafer oxidation during storage; and the existing nitrogen cabinets need to be replenished all the time Nitrogen, high operating costs

In addition, the structure of the nitrogen cabinet is integrated, that is, multiple material boxes (Foup) are put into the storage space of the nitrogen gas cabinet for storage, which limits that multiple material boxes must be in and out at the same time. If you need to take out a material box , it is also necessary to pump out the nitrogen in the entire storage space, which causes a certain degree of waste of resources, and the operation is highly restrictive

[0003] At present, industrial ovens for semiconductor packaging are also integrated ovens. During the storage period, the temperature of all products in the entire oven needs to be adjusted for easy access, resulting in a certain degree of waste of resources.

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