Novel indirect-type high-temperature hydrogen fluoride ionized gas cleaning reactant, technology and device

A gas cleaning and hydrogen fluoride technology, applied in the field of indirect high-temperature hydrogen fluoride ion gas cleaning, can solve the problems of inability to carry out deep brazing/welding work, failure to provide sufficient safety guarantee for reaction gas leakage, and lack of availability.

Inactive Publication Date: 2017-06-13
力航
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Problems solved by technology

[0015] 1. The reactant used is due to or involves high-temperature pyrolysis of Teflon to produce carbon on the surface of the parts or the use of a large amount of ammonium bifluoride and poor sealing of the equipment, resulting in a poor working environment;
[0016] 2. Failure to provide sufficient safety guarantees for the possible leakage of reactive gases;
[0017] 3. Failure to realize the ability to increase the cleaning efficiency from the perspective of improving the chemical reaction kinetics and ensuring the activity of the reaction gas through the pressure change of the cleaning gas;
[0018] 4. The same furnace does not have the ability to clean the parts with hydrogen fluoride ion gas and provide the ability to use high-temperature vacuum to remove residual fluoride on the surface of the workpiece after the cleaning process is completed.
Due to the difficulty of introducing foreign commercial reactors, it is almost impossible to carry out deep brazing / welding of high / low pressure moving / stationary blades of aero-engines and other gas turbine turbines, which seriously restricts the technological development of related fields

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  • Novel indirect-type high-temperature hydrogen fluoride ionized gas cleaning reactant, technology and device
  • Novel indirect-type high-temperature hydrogen fluoride ionized gas cleaning reactant, technology and device
  • Novel indirect-type high-temperature hydrogen fluoride ionized gas cleaning reactant, technology and device

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Embodiment Construction

[0083]The invention relates to the use of cleaning agent related to the new indirect high-temperature hydrogen fluoride ion gas cleaning technology, the chemical reactions related to the cleaning process, the cleaning process and the corresponding cleaning equipment and other aspects of technical content. The technical solutions in the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the present invention.

[0084] The invention provides a novel indirect high-temperature hydrogen fluoride ion gas cleaning reagent, which is made of solid CrF 2 The main compound, metal Cr and solid ammonium bifluoride form a compound reactant according to the mass ratio (3.0-20.0):(80.0-97.0):(0.3-3.0). The selection of this compound reactant not only avoids the surface area carbon problem of cleaning parts that may be caused by the use of Teflon, but also can effectively reduce the consumption of ammonium bifluoride, wherein the s...

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Abstract

The invention provides a novel indirect-type high-temperature hydrogen fluoride ionized gas cleaning reactant. A compound dominated by solid-state CrF2, metal Cr and solid-state ammonium bifluoride form the compound reactant according to the mass ratio of (3.0-20.0):(80.0-97.0):(0.3-3.0). The invention further provides a cleaning device and technology. The cleaning reactant, device and technology are innovated, the compound dominated by the solid-state metal fluoride CrF2, the metal Cr and the solid-state ammonium bifluoride are adopted to form the compound reactant, the reactant is reacted with hydrogen in a sealed high-temperature reactor to form hydrogen fluoride gas, oxide on the part surfaces is removed through the produced hydrogen fluoride gas, reaction gas leakage can be prevented, the purposes of efficient hydrogen fluoride ionized gas cleaning and subsequent high-temperature vacuum removal of remaining fluoride on the workpiece surfaces can be achieved at the same time by operating gas pressure change in the reactor, using safety is guaranteed, and a good working environment is created.

Description

technical field [0001] The invention relates to an indirect high-temperature hydrogen fluoride ion gas cleaning technology, in particular to a novel indirect high-temperature hydrogen fluoride ion gas cleaning reagent, process and device. Background technique [0002] The high-temperature hydrogen fluoride ion gas cleaning device is a key equipment commonly used in the deep repair industry of aero-engines and other high-temperature alloy parts of various gas turbines in advanced industrialized countries abroad. This type of device is used in the gas-phase cleaning process that must be carried out before high-temperature brazing and precision welding depth repair of expensive nickel-based and cobalt-based components in various gas turbines and aero-engines. The manufacturing and control technology of this kind of equipment is extremely demanding and expensive, and the only two manufacturers of commercialized equipment in the world are in the United States. It is difficult for...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23G5/00
CPCC23G5/00
Inventor 力航江航
Owner 力航
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