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Transient temperature and thermal flux simultaneous measurement sensor and preparation method thereof

A technology of heat flux density and transient temperature, applied to thermometers, thermometers with directly heat-sensitive electric/magnetic elements, instruments, etc., can solve the problem of not being able to measure temperature at the same time, achieve small size, improve sensitivity, and response speed fast effect

Inactive Publication Date: 2017-06-13
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This invention can realize the transient measurement of heat flux density, but it cannot measure the temperature at the same time

Method used

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  • Transient temperature and thermal flux simultaneous measurement sensor and preparation method thereof
  • Transient temperature and thermal flux simultaneous measurement sensor and preparation method thereof
  • Transient temperature and thermal flux simultaneous measurement sensor and preparation method thereof

Examples

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Effect test

Embodiment 1

[0040] like figure 1 , figure 2, image 3 As shown, a transient temperature and heat flux joint measurement sensor includes: ceramic substrate 1, positive thermocouple 2, negative thermocouple 3, thermocouple connection layer 4, thermal resistance layer 5, positive thermocouple lead terminal 6, The negative thermocouple terminal 7, the positive thermopile lead terminal 8 and the negative thermopile lead terminal 9, wherein:

[0041] The positive thermocouple 2, the negative thermocouple 3, the thermocouple connection layer 4, the thermal resistance layer 5, the positive thermocouple lead 6, the negative thermocouple 7, the positive thermopile lead 8 and the negative thermopile lead 9 are all It is set on the ceramic substrate 1; the positive thermocouple 2 and the negative thermocouple 3 are butted through the thermocouple connection layer 4; a positive thermocouple 2 and a negative thermocouple 3 are connected in series to form a pair of thermocouples, and multiple pairs o...

Embodiment 2

[0057] A method for preparing a sensor for joint measurement of transient temperature and heat flux, comprising the steps of:

[0058] The first step is to deposit a thin film by magnetron sputtering method, and realize patterning by mask sputtering method or liftoff method, so as to form positive thermocouple 2, positive thermocouple lead end 6 and positive thermopile lead end on ceramic substrate 1 8; where:

[0059] When the thin-film thermopile is a PtRh-Pt type thermocouple, the material of the positive thermocouple 2, the positive thermocouple lead 6 and the positive thermopile lead 8 is platinum rhodium;

[0060] When the thin-film thermopile is a Pt / ITO type thermocouple, the material of the positive thermocouple 2, the positive thermocouple lead 6 and the positive thermopile lead 8 is Pt;

[0061] In the second step, a layer of thermocouple connection layer 4 is formed at both ends of the positive thermocouple 2 in the first step by mask sputtering, and the material ...

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Abstract

The invention provides a transient temperature and thermal flux simultaneous measurement sensor and a preparation method thereof. The sensor comprises a ceramic substrate and positive electrode thermocouples, negative electrode thermocouples, thermocouple connecting layers, a thermal resistance layer, a positive electrode thermocouple lead end, a negative electrode thermocouple lead end, a positive electrode thermopile lead end and a negative electrode thermopile lead end which are arranged on the ceramic substrate; the positive electrode thermocouples and the negative electrode thermocouples are connected in a butt-joint mode through the thermocouple connecting layers, one positive electrode thermocouple and one negative electrode thermocouple is connected into a thermocouple pair in series, multiple thermocouple pairs are connected end to end in a lap-joint mode to form the thin-film thermopile, and the thermal resistance layer is arranged over a freezing point of the thermopile in a covering mode; when an external environment applies vertical thermal flow to the sensor, a heating point and the freezing point of the thin-film thermopile has a temperature difference, corresponding potentials are output according to a Seebeck effect, output of the heating point of one thermocouple pair of the sensor is related to the temperature, and the output potential of the thermopile is related to the thermal flux. The sensor can achieve transient measurement on the temperature and the thermal flux and has the advantages of being high in response speed, wide in measurement temperature range, high in measurement precision, capable of achieving simultaneous measurement on the temperature and the thermal flux and the like.

Description

technical field [0001] The invention relates to a heat flow measuring device in the field of micro-electromechanical technology, in particular to a sensor for joint measurement of transient temperature and heat flux density and a preparation method thereof. Background technique [0002] Nowadays, in industrial and agricultural production, scientific research, aerospace, power engineering and daily life, there are a lot of heat transfer problems to be solved. With the rapid development of modern science and technology, it is far from enough to only use temperature as the only information for heat transfer. Therefore, more and more attention has been paid to the theory and technology of heat flow detection, and the research and use of heat flow probes and heat flow meters, which are sensors for measuring heat flow, have become more extensive. Due to the development of the aerospace industry and the actual needs of thermal engineering, in aerospace, space technology and some h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K7/02
CPCG01K7/02G01K7/028
Inventor 李娟张丛春杨伸勇丁桂甫
Owner SHANGHAI JIAO TONG UNIV
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