Heat dissipation device and system for blade server chip

A blade server and heat dissipation device technology, applied in the field of computer room heat dissipation, can solve the problems of huge auxiliary supporting systems, limited heat dissipation efficiency, and cumbersome maintenance in the later stage, and achieve improved space utilization, strong heat dissipation and temperature control capabilities, and reduced thickness and volume. small effect

Pending Publication Date: 2017-06-16
CHINA ACAD OF AEROSPACE AERODYNAMICS
View PDF1 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The single-phase liquid cooling circuit is to directly transport the liquid to the surface of the heating chip through the pipeline to take away the heat, and the immersion liquid cooling is to immerse the chip directly in the liquid. However, both of th

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat dissipation device and system for blade server chip
  • Heat dissipation device and system for blade server chip
  • Heat dissipation device and system for blade server chip

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0058] In order to make the purpose, technical solution and advantages of the present invention clearer, the following will further describe the public implementation manners of the present invention in detail with reference to the accompanying drawings.

[0059] refer to figure 1 , shows a schematic structural diagram of a heat dissipation device for a blade server chip in an embodiment of the present invention. In this embodiment, the heat dissipation device for blade server chips includes: a first embedded heat pipe 1, and a second embedded heat pipe 2 arranged below the first embedded heat pipe 1, and a blade Server 3.

[0060] like figure 1 , the first embedded heat pipe 1 includes: a first evaporator 101 , a long gas pipeline 102 , a long liquid pipeline 103 and a first finned condenser 104 connected in sequence.

[0061] In this embodiment, the specific connection structure between the components in the first embedded heat pipe 1 is as follows: one end of the long ga...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Volumeaaaaaaaaaa
Login to view more

Abstract

The invention discloses a heat dissipation device and system for blade server chips, wherein the heat dissipation device comprises: a first embedded heat pipe and a second embedded heat pipe arranged below the first embedded heat pipe, and the blade server ; The first embedded heat pipe includes: the first evaporator connected in sequence, the long gas pipeline, the long liquid pipeline and the first finned condenser; the second embedded heat pipe includes: the second evaporator connected in sequence, the short gas pipeline, a short liquid pipeline and a second fin condenser; the blade server includes: a first chip and a second chip arranged inside the blade server; wherein, the first evaporator and the second evaporator are respectively connected to the first chip ( 301) and the second chip (302) are contacted and fixed. The invention simplifies the heat dissipation structure, improves the heat dissipation efficiency and reduces the equipment cost.

Description

technical field [0001] The invention belongs to the technical field of computer room heat dissipation, and in particular relates to a heat dissipation device and a heat dissipation system for blade server chips. Background technique [0002] With the increase of data center scale and cabinet power density, the heat dissipation and energy consumption of data centers (also known as computer rooms) has attracted more and more attention and attention. The traditional heat dissipation methods of data centers are mainly air-conditioning air cooling systems and single-phase circulating water cooling systems. Among them, the air-conditioning air-cooling system has a simple structure and is the easiest to implement, but has limited heat dissipation capacity and high energy consumption; the water-cooling system has a strong heat dissipation capacity, but the system is large and complex, and the water-cooling pipeline must be arranged outside the machine room for safety reasons. [00...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G06F1/20H01L23/467H01L23/473
CPCG06F1/20H01L23/467H01L23/473
Inventor 薛志虎谢铭慧陈思员曲伟俞继军艾邦成
Owner CHINA ACAD OF AEROSPACE AERODYNAMICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap