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Heat dissipation device and system for blade server chip

A blade server and heat dissipation device technology, applied in the field of computer room heat dissipation, can solve the problems of huge auxiliary supporting systems, limited heat dissipation efficiency, and cumbersome maintenance in the later stage, and achieve improved space utilization, strong heat dissipation and temperature control capabilities, and reduced thickness and volume. small effect

Pending Publication Date: 2017-06-16
CHINA ACAD OF AEROSPACE AERODYNAMICS
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Problems solved by technology

The single-phase liquid cooling circuit is to directly transport the liquid to the surface of the heating chip through the pipeline to take away the heat, and the immersion liquid cooling is to immerse the chip directly in the liquid. However, both of these two methods have huge auxiliary systems, high costs, and The post-maintenance is cumbersome, there are problems such as leakage safety hazards, and limited by the structure and internal space of the server, the heat dissipation efficiency is limited

Method used

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  • Heat dissipation device and system for blade server chip
  • Heat dissipation device and system for blade server chip
  • Heat dissipation device and system for blade server chip

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Embodiment Construction

[0058] In order to make the purpose, technical solution and advantages of the present invention clearer, the following will further describe the public implementation manners of the present invention in detail with reference to the accompanying drawings.

[0059] refer to figure 1 , shows a schematic structural diagram of a heat dissipation device for a blade server chip in an embodiment of the present invention. In this embodiment, the heat dissipation device for blade server chips includes: a first embedded heat pipe 1, and a second embedded heat pipe 2 arranged below the first embedded heat pipe 1, and a blade Server 3.

[0060] like figure 1 , the first embedded heat pipe 1 includes: a first evaporator 101 , a long gas pipeline 102 , a long liquid pipeline 103 and a first finned condenser 104 connected in sequence.

[0061] In this embodiment, the specific connection structure between the components in the first embedded heat pipe 1 is as follows: one end of the long ga...

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Abstract

The invention discloses a heat dissipation device and system for a blade server chip. The heat dissipation device comprises a first embedded heat pipe, a second embedded heat pipe arranged below the first embedded heat pipe and a blade server. The first embedded heat pipe comprises a first evaporator, a long gas pipeline, a long liquid pipeline and a first fin condenser which are connected in sequence. The second embedded heat pipe comprises a second evaporator, a short gas pipeline, a short liquid pipeline and a second fin condenser which are connected in sequence. The blade server comprises a first chip and a second chip which are arranged in the blade server, wherein the first evaporator and the second evaporator are in contact with and fixed with the first chip (301) and the second chip (302) respectively. A heat dissipation structure is simplified, the heat dissipation efficiency is improved, and the device cost is reduced.

Description

technical field [0001] The invention belongs to the technical field of computer room heat dissipation, and in particular relates to a heat dissipation device and a heat dissipation system for blade server chips. Background technique [0002] With the increase of data center scale and cabinet power density, the heat dissipation and energy consumption of data centers (also known as computer rooms) has attracted more and more attention and attention. The traditional heat dissipation methods of data centers are mainly air-conditioning air cooling systems and single-phase circulating water cooling systems. Among them, the air-conditioning air-cooling system has a simple structure and is the easiest to implement, but has limited heat dissipation capacity and high energy consumption; the water-cooling system has a strong heat dissipation capacity, but the system is large and complex, and the water-cooling pipeline must be arranged outside the machine room for safety reasons. [00...

Claims

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Application Information

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IPC IPC(8): G06F1/20H01L23/467H01L23/473
CPCG06F1/20H01L23/467H01L23/473Y02D10/00
Inventor 薛志虎谢铭慧陈思员曲伟俞继军艾邦成
Owner CHINA ACAD OF AEROSPACE AERODYNAMICS
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