Area array probe with balanced receiving and dispatching performances of micro-electro-mechanical ultrasonic transducer and manufacturing method for area array probe

Abstract

The invention discloses an area array probe with balanced receiving and dispatching performances of a micro-electro-mechanical ultrasonic transducer. The area array probe comprises a silicon substrate (1), wherein an oxide layer (2) is arranged on the silicon substrate (1); a plurality of cavities (3) are arranged on the upper surface of the oxide layer (2); the upper surface of the oxide layer (2) is bonded with a vibrating film (4); an isolating layer is arranged on the upper surface of the vibrating film (4); submerged isolating slots (6) are formed in positions, inside the isolating layer (5), around the peripheral edges of the isolating layer (5); the isolating slots (6) penetrate through the isolating layer (5) and the vibrating film (4), and then, slot bottoms are formed in the oxide layer (2); and an electrode (7) is arranged on a position, which is opposite to the center position of each cavity (3), on the upper surface of the isolating layer (5). The ultrasonic probe is novel in structure, is small in size, is wide in frequency band, is high in sensitivity, is low in noise, is good in stability and is balanced in receiving and dispatching performances.

Description

technical field [0001] The invention relates to a capacitive micro-mechanical ultrasonic transducer in the field of MEMS sensors, in particular to a structural design and a preparation method of a capacitive micro-mechanical ultrasonic transducer for ranging and imaging, which has the characteristics of balanced sending and receiving capabilities. Background technique [0002] With the rapid development of micro-electromechanical systems (MEMS, Micro-electromechanical Systems) and micro-nano technology, the manufacture of sensors has entered a new stage. At present, there are mainly three types of ultrasonic sensors: piezoelectric, piezoresistive and capacitive. Among them, the capacitive micro-machined ultrasonic transducer (CMUT) is flexible in design and processing, is less affected by temperature, responds to a wide frequency band, has a good matching between the production material and the dielectric impedance, and is easy to array processing. The integrated circuit ca...

AI Technical Summary

Problems solved by technology

When the CMUT is used in a transceiver integrated system, the transmission capability is weak under the same conditions

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