Absorption film system structure and preparation method of a wide-spectrum pyroelectric detector
A pyroelectric detector and film structure technology, applied in electric radiation detectors, vacuum evaporation plating, coatings, etc., can solve the problems of poor device process compatibility, affecting device response characteristics, and low reflectivity of porous black gold. , to achieve the effect of enhancing infrared absorption rate, improving process compatibility, and simplifying the preparation process
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Embodiment 1
[0030] Such as figure 2 As shown, a wide-spectrum pyroelectric detector absorbing film structure, including three layers of metal film with gradually increasing porosity, the structure is made of LiTaO 3 A crystalline flake is spread out as the top layer of the pyroelectric sensitive cell 1 .
[0031] LiTaO 3 The pre-preparation process of crystal flakes is as follows: in LiTaO 3 The lower electrode 5 was prepared on the wafer; the LiTaO 3 The wafer is thinned to form the pyroelectric sensitive unit 1 .
[0032] Wash LiTaO 3 Crystal flakes, photolithographically patterned on the upper surface. The underlying nickel-chromium alloy film is prepared by magnetron sputtering technology as the underlying metal film 2, the process pressure is adjusted to 4Pa, the sputtering current is 0.6A, and a dense nickel-chromium metal layer is obtained. The porosity range is controlled at 15%, and the thickness range is controlled. at 10nm.
[0033] The metal film 3 in the middle layer ...
Embodiment 2
[0037] Such as figure 2 As shown, a wide-spectrum pyroelectric detector absorbing film structure, including three layers of metal film with gradually increasing porosity, the structure is made of LiTaO 3 A crystalline flake is spread out as the top layer of the pyroelectric sensitive cell 1 .
[0038] LiTaO 3 The pre-preparation process of the crystal sheet is: preparing the lower electrode 5 on the lithium tantalate wafer; thinning the lithium tantalate wafer by grinding and polishing to form the pyroelectric sensitive unit 1 .
[0039] Wash LiTaO 3 Crystal flakes, photolithographically patterned on the upper surface. The underlying metal film 2 is prepared by magnetron sputtering technology, which is a bismuth metal film. The process pressure is adjusted to 5Pa, and the sputtering current is 0.7A to obtain a dense bismuth metal layer. The porosity range is controlled at 20%, and the thickness range is controlled at 10nm. .
[0040] The middle layer metal thin film 3 is...
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