Wafer box transmission device

Abstract

The invention discloses a wafer box transmission device. The wafer box transmission device comprises a loading mechanism, a translation mechanism and a transmission mechanism, wherein the loading mechanism is used for placing a wafer box, the translation mechanism is used for driving the loading mechanism to horizontally move in a first axial direction, a second axial direction and a third axial direction, the transmission mechanism is used for transmitting the translation mechanism, and the first axial direction, the second axial direction and the third axial direction form a space cartesian rectangular coordinate system or a space cartesian bevel angle coordinate system. By a combined mode of the loading mechanism and the transmission mechanism, the wafer box is directly moved to a part in front of a door opener by the transmission mechanism and is accurately sent to the door opener by the translation mechanism, thus, the step of manually or mechanically carrying the wafer box is omitted, the efficiency is improved, the cost is reduced, and the wafer box transmission device is high in automation.

Description

technical field [0001] The invention relates to a wafer box conveying device. Background technique [0002] In semiconductor manufacturing plants, wafers usually need to be efficiently transported and positioned between different process modules on the production line. The Equipment Front End Module (EFEM) is the key equipment to complete this task. The bridge between the handling system and the wafer processing system enables the wafers to be transported accurately without contamination. [0003] The front-end device of the equipment includes at least a front opening unified pod (Foup for short) for storing wafers, a loading port (Load Port) for carrying the wafer pod, and for taking the wafer out of the wafer pod and The manipulator is stored in the wafer box. The loading port includes a door opener and a bearing mechanism set on the door opener. When the transport trolley on the semiconductor production line moves to the loading port, the wafer box is placed on the loadi...

AI Technical Summary

Problems solved by technology

[0004] During the handling process of the wafer box on the transport trolley and the loading port, manual handling is time-consuming and laborious, and the degree of automation is not high

Mechanical handling can be realized by a multi-joint robot. Although mechanical handling meets the needs of a fully automatic production line, multi-joint robots have problems such as large footprint, high cost, and high power consumption. In addition, multi-joint robots must Treatment to ensure cleanliness greatly increases the cost of use

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