Anodic oxidation polishing system and method

Abstract

The invention discloses an anodic oxidation polishing system. The anodic oxidation polishing system comprises a control portion and a work portion; the control portion comprises a power source; the work portion comprises a movement platform which is provided with a sample; the sample is connected with an output anode of the power source; a container is installed above the sample; polishing liquid is contained in the container, can make contact with the sample and is connected with a cathode of the power source; a polishing head is further arranged in the polishing liquid; a polishing pad is installed at the bottom of the polishing head; a ball spline is connected to the upper portion of the polishing head; the upper portion of the ball spline is connected with a horizontal synchronous belt which is further connected with the output end of a motor; the top of the ball spline is connected with a load which is provided with a weight; a leaf spring is installed above the weight and is connected with one end of a supporting point; and the other end of the supporting point is connected with a balancing weight. According to the system, electrolyte can be conveniently replaced, the electrolyte concentration can be adjusted easily, the oxidization voltage can be adjusted, and the current change in the oxidization process can be monitored.

Description

technical field [0001] The invention belongs to the technical field of anodic oxidation polishing, and relates to an anodic oxidation polishing system and method. Background technique [0002] The research on the application of silicon carbide (SiC) as an optical part began in the 1970s. Due to its high mechanical hardness, strong chemical stability, good thermal stability, high surface quality, high specific stiffness, small thermal deformation coefficient, and small thermal expansion coefficient , good dimensional stability, good optical machinability, good radiation resistance and other advantages, it has been widely used in the field of optics, especially in space optical systems, and its processing technology has become one of the research hotspots in the field of optical mirror processing. According to the preparation process, commonly used SiC materials can be divided into four types: hot press sintered SiC (HP-SiC), atmospheric pressure sintered SiC (S-SiC), reaction...

AI Technical Summary

Problems solved by technology

It can be seen from the sintering preparation process that RB-SiC contains two phases, SiC and Si. Due to the difference in physical and chemical properties between the SiC phase and the Si phase, it is difficult to directly process RB-SiC to obtain a high-quality surface that meets the requirements of optical applications.

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