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Sputtering apparatus

A sputtering device and area technology, applied in sputtering plating, ion implantation plating, metal material coating process, etc., can solve the problem that metal substances will not be deposited uniformly

Active Publication Date: 2017-07-11
SAMSUNG DISPLAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, there may be a problem that the metal substance is not uniformly deposited on the substrate surface because the argon gas etc. does not uniformly collide with the metal target

Method used

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Embodiment Construction

[0029] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those skilled in the art of the present invention can easily implement them. The present invention can be realized in many different forms and is not limited to the embodiments described here. In order to clearly describe the present invention, parts irrelevant to the description are omitted from the drawings, and the same reference numerals are used for the same or similar structural elements throughout the specification.

[0030] In addition, for convenience of description, the size and thickness of each structure shown in the drawings are arbitrarily shown, and therefore the present invention is not necessarily limited to the contents shown in the drawings.

[0031] In order to clearly show the respective layers and regions, the thicknesses are exaggerated in the drawings. Also, for convenience of description, the thicknesses of some lay...

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Abstract

The present invention relates to a sputtering apparatus. The sputtering apparatus, according to an embodiment of the present invention, may include a first electrode and a second electrode disposed in a cavity facing each other; a plurality of targets arranged on a first side of the second electrode and spaced from one another in a first direction; a magnetic field generating portion located on a second side of the second electrode facing the opposite side of the first face and including a plurality of magnet members arranged to correspond to each of the plurality of targets. The magnetic field strength of each magnet member in a marginal region in a second direction crossing the first direction is smaller than the central region of the magnet member.

Description

technical field [0001] The invention relates to a sputtering device. Background technique [0002] Currently known display devices include a liquid crystal display (LCD), a plasma display panel (PDP), an organic light emitting diode device (OLED), and the like. [0003] In order to form such a display device, various processes, such as thin film deposition, photo-lithography, or etching, for forming a thin film composed of a predetermined substance are required. [0004] Among them, the sputtering device used in the thin film deposition process is a device for depositing a metal thin film on a substrate, using the principle that when a direct current voltage is applied to two electrodes under vacuum and argon (Ar) gas or the like is injected, the argon is ionized At the same time, it is accelerated toward the cathode, and the particles of the metal target arranged at the cathode are released by collision, and the released particles at this time adhere to the surface of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35C23C14/56
CPCC23C14/35C23C14/351C23C14/352C23C14/56
Inventor 李栋熙申相原
Owner SAMSUNG DISPLAY CO LTD