Micro-electro-mechanical system platform based on optical detection

Abstract

The invention discloses a micro-electro-mechanical system platform, including a platform main body, an optical detection mechanism and an external packaging plate. The platform main body comprises a vibration platform. The external packaging plate forms a confined space, and the platform main body and the optical detection mechanism are enclosed in the sealed space. The optical detection mechanism includes a laser, a reflector and a diode array. The reflector is horizontally fixed to the top of the vibration platform with the mirror facing the top of the external packaging plate. The laser and the diode array are located inside the top of the external packaging board, and the diode array includes a plurality of photodiodes. The diode array encloses the laser. The light emitted from the laser is irradiated onto the reflector and the reflected light formed by the reflection of the reflector is irradiated onto the diode array. The diode array detects the light intensity of the reflected light. The micro-electro-mechanical system platform improves the linearity of the measurement result and improves the detection precision.

Description

technical field [0001] The invention relates to the field of micro-electro-mechanical systems, in particular to a micro-electro-mechanical system platform based on optical detection. Background technique [0002] Micro-Electro-Mechanical System (MEMS, Micro-Electro-Mechanical System) platform is a micro-scale platform supported by a specific support structure. The MEMS platform can realize multi-axis motion under the drive control of MEMS drive technology such as electrostatic drive, electromagnetic drive, piezoelectric drive and other technologies, including vibration, translation, etc., and can be applied to the positioning and movement of small MEMS devices. [0003] MEMS piezoelectric actuators, which use piezoelectric drive technology to achieve drive control, have been widely accepted due to their advantages such as small size, light weight, low price, high displacement resolution, large output force, large load bearing, fast response speed, and large instantaneous acc...

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Problems solved by technology

[0007]However, the biggest problem with using plate capacitance to measure vibration is that the change of the capacitance value with the displacement of the MEMS platform during the vibration process is not linear, and additional correction is required. And because the capacitance value is small, the input impedance of the measurement circuit is very high, and the influence of factors such as parasitic capacitance makes the signal processing very difficult, making the measurement results of the technical means of integrating the capacitance detection structure on the micro-electromechanical system platform The linearity is poor, and the detection accuracy is not high enough

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