Thermal imaging sensor pixel unit and thermal imaging sensor pixel array

A sensor pixel and thermal imaging technology, applied in the field of measurement, can solve the problems affecting the response speed of the amplitude system of temperature changes, increase the heat capacity of the system, etc., and achieve the effects of improving accuracy, reducing heat capacity, and increasing the temperature rise range

Inactive Publication Date: 2017-07-14
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this structure also has obvious shortcomings, mainly because the two-layer structure and supporting columns greatly increase t...

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  • Thermal imaging sensor pixel unit and thermal imaging sensor pixel array
  • Thermal imaging sensor pixel unit and thermal imaging sensor pixel array
  • Thermal imaging sensor pixel unit and thermal imaging sensor pixel array

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Experimental program
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Embodiment Construction

[0030] Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0031] An embodiment of the present invention provides a thermal imaging sensor pixel unit, including:

[0032] A substrate 302, a heat concentrating component and a heat absorbing component; the heat absorbing component is located between the substrate and the heat concentrating component;

[0033] The heat gathering component includes a focusing lens; the focusing lens is embedded in a hollow frame 102 and suspended above the heat absorbing component;

[0034] The heat absorbing assembly includes a heat absorbing plate 201 and a temperature sensor 202 located on the surface of the heat absorbing plate; the heat absorbing plate 201 is suspended above the substrate 302 through a first support frame;

[0035] The focusing lens is used to focus heat radiation to the surface of the heat absorbing plate 201 .

[0036] Such as figure 1 As shown, in order t...

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PUM

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Abstract

The invention relates to a thermal imaging sensor pixel unit and a thermal imaging sensor pixel array. The pixel unit comprises a substrate, a heat gathering component, and a heat absorbing component. The heat absorbing component is disposed between the substrate and the heat gathering component. The heat gathering component includes a focusing lens which is embedded into a hollow frame and erected above the heat absorbing component in a suspended manner. The heat absorbing component includes a heat absorbing plate and a temperature sensor on the surface of the heat absorbing plate. The heat absorbing plate is erected above the substrate in a suspended manner through a first support rack. The focusing lens is used for gathering heat radiation to the surface of the heat absorbing plate. According to the technical scheme provided by an embodiment of the invention, as the suspended focusing lens is arranged to gather heat radiation of objects, heat scattering is reduced, the proportion of heat absorption is increased, and the accuracy of detection is increased.

Description

technical field [0001] The invention relates to the field of measurement technology, in particular to a thermal imaging sensor pixel unit and an array thereof. Background technique [0002] According to Planck's black body radiation theory, any object with a temperature above absolute zero will emit infrared radiation related to its properties, also known as thermal radiation. The thermal radiation characteristics of an object are mainly determined by the temperature of the object. The higher the temperature, the greater the radiation intensity and the higher the energy. Sensors capable of infrared radiation detection are called infrared sensors or infrared detectors, which are divided into two categories: photonic infrared sensors and calorimetric infrared sensors. Photonic infrared sensors use the photoelectric effect of semiconductor materials to achieve infrared measurement by measuring the photovoltaic or photoconductive phenomena generated by the change of the electro...

Claims

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Application Information

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IPC IPC(8): G01J5/10G01J5/08
CPCG01J5/10G01J5/0806G01J2005/0077G01J2005/103G01J2005/106
Inventor 王喆垚
Owner TSINGHUA UNIV
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