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An online monitoring device for grinding and polishing processing status

A monitoring device and processing state technology, applied in the field of precision and ultra-precision machining, can solve the problems of large influence by external interference, complex structure, low precision, etc., and achieve the effects of low equipment requirements, low cost and convenient operation.

Active Publication Date: 2019-08-09
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to design a simple structure, easy to use, which can monitor the processing state of grinding and polishing online, quickly and accurately, in view of the problems that the existing online detection devices have complex structures, are greatly affected by external interference, and have low precision. On-line monitoring device for grinding and polishing processing status

Method used

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  • An online monitoring device for grinding and polishing processing status
  • An online monitoring device for grinding and polishing processing status

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] For example, during the grinding and polishing process, the acoustic emission sensor installed on the wafer carrier collects the acoustic emission signal generated by the abrasive particles and the workpiece, and the weak current signal obtained by the sensor is amplified and filtered through the signal conditioning circuit, and the data is collected. The device collects the processed analog voltage signal with a sampling rate of 2M and a resolution of 16 bits, and converts it into a digital signal and transmits it to the computer for display and storage. By analyzing the signal on the computer side, such as performing wavelet transformation on the signal, when the signal characteristics corresponding to the scratch defect of the workpiece appear, the operator can perform appropriate operations on the grinding and polishing process to improve the processing status of the grinding and polishing; The mathematical relationship between the intensity of the emission signal an...

Embodiment 2

[0026] For example, in the process of chemical mechanical polishing, the load sensor installed on the wafer carrier collects the resistance in the horizontal direction between the workpiece and the polishing pad, and the electrical signal collected by the sensor is amplified and filtered through the signal conditioning circuit. The 16-bit resolution of the data collector collects the processed analog voltage signal, converts it into a digital signal and transmits it to the computer to realize the display and storage functions. By analyzing the signal on the computer side, such as using the friction resistance in the horizontal direction of the workpiece and the pressure in the vertical direction, the friction coefficient between the workpiece and the polishing pad can be calculated, and the polishing liquid can be obtained by comparing the friction coefficients obtained by different calculations. To determine the type of softened layer qualitatively produced by the chemical act...

Embodiment 3

[0028] For example, during the grinding and polishing process, the acceleration sensor installed on the wafer carrier collects the vibration signal of the wafer carrier and the workpiece, and the signal conditioning circuit performs necessary amplification and filtering on the electrical signal collected by the sensor. The data collector The processed analog voltage signal is collected with 16-bit resolution, converted into digital signal and transmitted to the computer to realize display and storage functions. By analyzing the signal on the computer side, such as vibration signal strength analysis, a relationship model between vibration signal strength and surface roughness is established, and the surface roughness of the processed workpiece is estimated by calculating the vibration signal strength.

[0029] The working principle of the present invention is:

[0030] Such as figure 1 shown.

[0031] 1. When grinding and polishing, the grinding and polishing pad on the ring ...

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Abstract

The invention discloses a grinding and polishing state online monitoring device. The device is characterized in that a ring polishing machine is involved, one motor drives a grinding and polishing disc (1) to rotate, the other motor drives a retaining ring (4) to rotate, the grinding and polishing disc (1) is provided with a grinding and polishing pad (3), a wafer loader (2) is installed in the retaining ring (4), a workpiece (5) is installed on the lower portion of the wafer loader (2) and does relative grinding and polishing with the grinding and polishing pad (3) under the drive of the retaining ring, a sensor (6) is installed on the wafer loader (2), the sensor (6) is electrically connected with a signal processing circuit (7) fixedly installed on a platform (10), the signal processing circuit (7) is electrically connected with a data collector (8) fixedly installed on the platform (10), the data collector (8) is connected with a computer through a conductive sliding ring (9), and the platform is installed on the retaining ring (4) and achieves synchronous rotation. The grinding and polishing state online monitoring device has low requirements for equipment, and is low in cost and convenient to operate.

Description

technical field [0001] The invention relates to the field of precision and ultra-precision machining, in particular to a finishing monitoring technology, in particular to an online monitoring device for grinding and polishing processing status based on sensor technology, high-speed data collection and processing. Background technique [0002] With the rapid development of optics, optoelectronics, integrated circuits and material technology, the requirements for surface quality of material processing are becoming higher and higher. In addition, some functional materials have broad application prospects and demands in optics, electronics, instrumentation, aerospace and other fields due to their unique properties. Most of the above materials use ultra-precision grinding and polishing as their processing methods, such as the commonly used chemical mechanical polishing (CMP). However, many essential phenomena in the grinding and polishing process, such as the mechanism of materi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B49/00
CPCB24B49/00
Inventor 李军仝浩呈朱永伟左敦稳郭太煜王健杰黄俊阳
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS