A kind of flexible transparent electrode and preparation method thereof
A transparent electrode and flexible technology, applied in the field of electrodes, can solve the problems of no transparent electrode preparation, achieve the effects of short production cycle, easy realization, and improved bending and stability
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Embodiment 1
[0048] (1) Use a transparent glass plate with a thickness of 0.5-1cm as the substrate, after cleaning with alcohol, use electron beam evaporation technology to deposit a metal cathode on each adjacent side of the substrate with a thickness of 30-50nm, and the material is selected from gold ;
[0049] (2) Adhering a PET film with a thickness of 0.1 to 1 cm on the surface of the substrate;
[0050] (3) Preparation of 0.05M copper sulfate CuSO 4 / H 2 SO 4 The solution is injected into the glass microtube, and one side of the metal cathode is selected, and connected to the negative pole / ground wire of the external DC power supply through a metal wire, and the metal wire connected to the positive pole of the external DC power supply is inserted into the glass microtube, along with the needle tip of the glass microtube and the metal When the cathode slowly approaches a certain distance, the liquid at the needle tip first contacts the metal cathode to generate a loop current, and ...
Embodiment 2~5
[0057] The preparation process is the same as in Example 1, except that the humidity in the electrochemical deposition process in step (3) is replaced by 50% RH, 60% RH, 80% RH and 90% RH respectively.
[0058] It has been found through experiments that during the deposition process of Example 2, due to the low ambient humidity, the formed liquid bridge solidifies too quickly, and the Cu 2+ The 2 electrons obtained are quickly reduced to metal Cu, which blocks the needle tip, hinders the movement of the glass microtube, and causes the deposition process to no longer proceed.
[0059] Comparing the deposition process of Examples 4-5, it is found that relative to 80% RH, when the humidity is 90% RH, the time for depositing micro / nano wires of the same size will be extended by about 20%, which increases the production cycle.
Embodiment 6~8
[0061] The preparation process was the same as in Example 1, except that the deposition voltages in the electrochemical deposition process of step (3) were replaced by 0.4V, 0.5V and 0.7V respectively.
[0062] After testing, it was found that the surface roughness of the copper wires corresponding to the application of voltages of 0.4V, 0.5V and 0.7V were 0.1 μm, 0.07 μm and 0.09 μm respectively.
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