Preparation method of automotive indicating discoloration-preventing LED lamps
A technology of LED lights and indications, applied in the direction of epoxy resin glue, adhesive type, adhesive additives, etc., can solve the problems that affect the effect of vehicle-mounted LED lights to prompt relevant vehicle information, reduce the display effect of vehicle lights, etc., to achieve The effects of prolonged light decay and color change decay time, less colloidal influence, and improved quality
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Embodiment 1
[0021] A method for preparing an automotive indication and anti-discoloration LED lamp, comprising the following steps:
[0022] Step 1) Fixing the crystal, gluing the light-emitting body on the bracket through the crystal-bonding glue and baking to fix it, so as to facilitate the position setting;
[0023] Step 2) welding wires, welding the lead wires to form a conductive circuit, so that the LED lamp can shine brightly;
[0024] Step 3) Prepare the colloid, crush the raw rubber cake and grind it into a rubber cake powder, then add YAG powder and graphene powder and stir evenly. When stirring, put the rubber cake powder, YAG powder and graphene powder into the same container Stir with a stainless steel rod for 20 minutes. When stirring, first stir clockwise for 5 minutes, then counterclockwise for 5 minutes, then clockwise for 5 minutes, and finally counterclockwise for 5 minutes to obtain a mixed powder. The above method can quickly complete the uniform stir;
[0025] Step...
Embodiment 2
[0031] The difference between Embodiment 2 and Embodiment 1 is that, when the above-mentioned crystal-bonding glue is configured, it includes the following components in parts by weight: 80 parts of epoxy resin, 20 parts of toughening resin, 10 parts of nano-silicon carbide, chromium carbide 1 part, 7 parts of graphene liquid, 7 parts of ceramic micropowder, 2 parts of cationic curing agent, 5 parts of urea and 1 part of isocyanate.
Embodiment 3
[0033] The difference between Embodiment 3 and Embodiment 1 is that the above-mentioned crystal-bonding glue contains the following components in parts by weight when it is configured: 90 parts of epoxy resin, 25 parts of toughening resin, 15 parts of nano-silicon carbide, chromium carbide 5 parts, 5 parts of graphene liquid, 9 parts of ceramic micropowder, 3 parts of cationic curing agent, 9 parts of urea and 3 parts of isocyanate.
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