White-light LED COB with CSP chip andlip blue-light chip encapsulation and preparation method thereof

A LED chip and flip-chip technology, which is applied in the field of lighting, can solve problems such as complex and difficult COB technology for color matching, and achieve the effects of uniform distribution, small near-field color temperature change, and improved product reliability

Pending Publication Date: 2017-08-11
SHINEON BEIJING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0018] The purpose of the present invention is to provide a structure and preparation method of a white LED COB packaged with a CSP chip and a flip-chip blue LED chi...

Method used

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  • White-light LED COB with CSP chip andlip blue-light chip encapsulation and preparation method thereof
  • White-light LED COB with CSP chip andlip blue-light chip encapsulation and preparation method thereof
  • White-light LED COB with CSP chip andlip blue-light chip encapsulation and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0076] Embodiment 1. Dual circuit scheme:

[0077] Such as Figure 6 As shown, the structure of a white LED COB packaged with a CSP chip and a flip-chip blue LED chip includes a square COB substrate 3-5, and a flip-chip blue LED chip array 3-5 is soldered to the middle of the COB substrate 3-5 by reflow soldering. 12 and warm color temperature CSP arrays 3-10, the two arrays are arranged in an orderly manner as required. On the four corners of the COB substrate 3-5, the positive electrode 1 and the negative electrode 1 of the CSP circuit 3-11 for controlling the warm color temperature are correspondingly provided, and the positive electrode 2 and the negative electrode 2 of the flip-chip blue LED chip circuit 3-14 are controlled. The peripheral area is provided with a circuit layer 3-3 and a solder resist layer 3-6. The CSP circuit 3-11 for controlling the warm color temperature and the circuit 3-14 for controlling the flip-chip blue LED chip are respectively connected to th...

Embodiment 2

[0083] Embodiment 2. Single circuit solution:

[0084] Such as Figure 7 As shown, the structure of a white LED COB packaged with a warm color temperature CSP array 3-10 and a flip-chip blue LED chip array 3-12 includes a square COB substrate 3-5, and the middle part of the COB substrate 3-5 is welded by reflow soldering There are flip-chip blue LED chip arrays 3-12 and low color temperature CSP light source arrays, and the two arrays are arranged in an orderly manner as required. On the two corners of the diagonal line of the COB substrate 3-5, the anode and cathode for simultaneously controlling the low color temperature CSP circuit and the flip-chip blue LED chip circuit are correspondingly provided, and the circuit layer 3-3 and Solder mask 3-6. The low color temperature CSP circuit and the flip-chip blue LED chip circuit are respectively connected to the corresponding electrodes after the serial-parallel connection of the circuit on the COB substrate. Around the two ar...

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Abstract

The invention discloses a structure of a white-light LED COB with CSP chip and a flip blue-light chip encapsulation and a preparation method thereof, so that problems of high difficulty of complexity of the color-tuning COB process can be solved and simple and efficient production of the customized color-tunable COB can be realized. The structure is formed by flip blue-light LED chips, low-color-temperature CSP light sources, and high-color-temperature phosphor silica gel; a plurality of strings of flip blue-light LED chips connected in parallel and a plurality of strings of low-color-temperature CSP light sources connected in parallel are connected to a positive electrode and a negative electrode jointly to form a dual-circuit structure; or a plurality of strings of flip blue-light LED chips connected in parallel and a plurality of strings of low-color-temperature CSP light sources connected in parallel are connected in parallel and then the parallel unit is connected to a positive electrode and a negative electrode jointly to form a single-circuit structure. The two kinds of circuit structures welded respectively are distributed on a COB substrate uniformly and are connected with corresponding electrodes respectively by lines on the COB substrate. A dam formed by a white dam adhesive is arranged around the two kinds of circuit structures and the blank area inside the dam is filled with the high-color-temperature phosphor silica gel, thereby forming a white-light LED COB structure.

Description

technical field [0001] The invention belongs to the lighting field, and in particular relates to a structure and a preparation method of a white LED COB packaged with a CSP chip and a flip-chip blue LED chip. Background technique [0002] In LED applications, the so-called CSP light source refers to a type of LED device, the core part of which is a flip-chip blue chip with a sapphire substrate. Except for the side with positive and negative electrodes, part of its surface is covered by phosphor film. Wherein, the positive and negative soldering legs are connected to the applied circuit substrate through soldering tin. Since the CSP light source only uses fluorescent powder silicone film to cover the structure of the flip chip, it eliminates most of the packaging steps and structure of the traditional LED light source, making the size of the package small, and the volume of the package is no more than 20% of the volume of the flip chip. %. When the CSP light source is energ...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/48H01L33/62
CPCH01L25/0753H01L33/486H01L33/62H01L2933/0066H01L2933/0033H01L2224/14H01L2224/48091H01L2224/49107H01L2224/73265H01L2924/00014
Inventor 孙国喜申崇渝石建青刘国旭
Owner SHINEON BEIJING TECH
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