Processing method for UV laser incision butt-joint uncovering

A technology of laser and crossover wires, which is applied in the structural connection of printed circuits, multi-layer circuit manufacturing, printed circuit components, etc., can solve problems such as poor opening of the cover, and achieve the effect of improving production efficiency and reducing production costs

Inactive Publication Date: 2017-08-11
GULTECH WUXI ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally, the process of opening the cover after the combination of soft and hard boards mostly adopts the method of laser fixed depth cutting to remove the cover plate, because it is fixed depth cutting (control the cutting depth, keep a certain depth without cutting, and avoid cutting the soft board) and has residual thickness (fixed depth cutting) Deep cutting to the thickness between the soft board) control, the processing of this method will more or less have some abnormalities such as poor opening of the cover

Method used

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  • Processing method for UV laser incision butt-joint uncovering
  • Processing method for UV laser incision butt-joint uncovering
  • Processing method for UV laser incision butt-joint uncovering

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Embodiment Construction

[0018] The specific embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

[0019] A processing method for UV laser cutting butt joint opening, such as Figure 1-6 , including the following steps:

[0020] 1), such as figure 1 As shown, to make the soft board layer of the inner core board of the printed circuit soft-rigid board: evenly lay the complete first copper foil 2-1 on the top and bottom of the soft board 1; 2), stick and press on the area where the finished product needs to be bent Combine the cover film 3; 3), make the first prepreg 4-1, such as figure 2 As shown, open the window 6 design at the position of the corresponding soft area; 4) Make the hard board layer of the inner core board of the printed circuit flex-hard board: there are two hard board layers, each with a thickness of 0.15mm. The second copper foil 2-2 with windows is evenly laid on the top and bottom of the board 5 corresponding to the...

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Abstract

The invention relates to a cutting method and specifically relates to a processing method for UV laser incision butt-joint uncovering. The method comprises the following steps: manufacturing a soft plate layer of an inner core plate of a soft and hard combined printed circuit board, adhering, pressing and covering a film in a bent area of an end product; manufacturing a first half-curing chip and designing a window on a position of a corresponding soft area; manufacturing a hard plate layer of the soft and hard combined printed circuit board, manufacturing a second half-curing chip, designing no window in the corresponding inner core plate area and reserving the whole half-curing chip; pressing: successively arranging in the sequence from top to bottom; after the ending of the processing, performing laser incision uncovering on the end product of the plate. According to the cutting method provided by the invention, the paved copper is designed on soft and hard connecting wires at interval in each layer of a cover plate, the stress is fully concentrated at a pre-cut gap on the hard plate layer and the cover plate is broken at the soft and hard connecting wires, so that the uncovering quality is guaranteed, the soft plate is not cut and the product yield is high.

Description

technical field [0001] The present invention relates to the technical field of printed circuit board production. The present invention discloses a cutting method for the uncapping process of a rigid-flex board for short. The present invention specifically discloses a UV laser cutting butt jointing and uncapping processing method. Background technique [0002] With the development trend of thinner, more integrated and multi-functional consumer electronic products, the requirements for the manufacturing process of printed circuit boards are getting higher and higher. Following this trend, the soft-rigid printed circuit board will gradually become an important part of the printed circuit board. The advantages of this product are that it can save more design space, reduce assembly, faster signal transmission, and more stable features. [0003] Rigid-flex boards generally have two general processing techniques: front-opening and back-opening. This patent is mainly aimed at the p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14H05K3/46
CPCH05K1/148H05K3/4691H05K2203/107
Inventor 华福德张志敏
Owner GULTECH WUXI ELECTRONICS CO LTD
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